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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 19 Jan 2000 08:31:27 -0700 |
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Ok..so what are the causes of solder beads??
> -----Original Message-----
> From: Kinol, Vince [SMTP:[log in to unmask]]
> Sent: Wednesday, January 19, 2000 6:17 AM
> To: [log in to unmask]
> Subject: Re: [TN] Reflow soldering >>> Solder balls
>
> Jens,
> I believe the TechNet archives will have some detail on solder balls. In
> general there are a few causes for the formation of solder balls.
> Environmental exposure of the paste to moisture, this can be from high
> humidity, extended queue times after printing or exposure of below room
> temperature paste to room temperature air. (ie paste is below dew point)
> Another cause would be oxidation of the solder alloy. This may exist in
> the
> paste or be formed during the reflow process, due to the profile not being
> optimized to the flux.
> Also just a note solder balls are very small and should not be confused
> with
> solder beads, large coalesced solder found at times at edges of caps and
> resistors.
> Feel free to contact me off line for more details.
> VBK
> Vincent B. Kinol CQE [log in to unmask] <mailto:[log in to unmask]>
> Applications Engineer OMG Americas Microbond
> Phone 919-544-8090 x298 FAX 919-544-7996
>
>
> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Tuesday, January 18, 2000 11:16 PM
> To: [log in to unmask]
> Subject: [TN] Reflow soldering >>> Solder balls
>
> Hi,
>
> sorry for this basic basic question!
> Are there any resources for the solder balls problem? Where do the
> come from and how to prevent them?
> Is there any site for solder defects info ?
> regards
> Jens Behrens
>
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