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November 2010

TGAsia@IPC.ORG

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Subject:
From:
shi hongbin <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, shi hongbin <[log in to unmask]>
Date:
Thu, 11 Nov 2010 16:19:13 +0900
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ansys就可以

在 2010年11月11日 下午4:17,Wei Wen <[log in to unmask]> 写道:
> 我们没有专业的热分析工程师,不知道有没有PCB布局工程师有这方面的经验的,通常是用什么样的软件可以来做模拟?谢谢!
> ________________________________
> From: SUN Zhaopu [mailto:[log in to unmask]]
> Sent: 2010年11月11日 15:12
> To: Asia Committe Task Group Forum; Wei Wen
> Subject: RE: [TGAsia] Thermal analysis
>
> 你们有热分析的工程师吗?做好请专业工程师来做。
> ________________________________
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of Wei Wen
> Sent: 2010年11月11日 14:56
> To: [log in to unmask]
> Subject: [TGAsia] Thermal analysis
>
> 大家好,
>
> 向各位请教一个问题,因为有一个元件的特殊封装(QFP mix
> QFN)水洗工艺过程中很难洗干净QFN下散热Pad的Flux残留。我们的提议是更改PCB设计,改动单个大的散热焊盘为多个小焊盘并从PCB反面增加非电镀通孔以便水洗时溶液容易通过,因为散热焊盘面积的缩小会导致散热效率不同,我们需要提供给客户一份散热分析报告以证明这样更改的可行性,不知如何来做这个散热分析?
>
> 目前不能改成免洗工艺原因是测试点的Flux残留会影响到测试的可靠性。
>
> WenWei
> Flextroncis Suzhou
>
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-- 
Best Regareds!
SHI Hongbin (史 洪賓)

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