TGASIA Archives

July 2014

TGAsia@IPC.ORG
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Subject:
BGA锡球塌陷标准
From:
刘兵(LIU Bing) <[log in to unmask]>
Reply To:
刘兵(LIU Bing) <[log in to unmask]>
Date:
Thu, 17 Jul 2014 06:38:03 +0000
Content-Type:
text/plain
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text/plain (1 lines) 
各位好！
      请教在SMT焊接中，不同pitch的BGA锡球是否有塌陷标准？谢谢！



刘  兵

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