TGASIA Archives

June 2010

TGAsia@IPC.ORG

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Subject:
From:
William Yeoh <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, William Yeoh <[log in to unmask]>
Date:
Thu, 3 Jun 2010 17:30:30 +0800
Content-Type:
text/plain
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text/plain (74 lines)
Hi Matthew,

Actually it is for IC molding, not sure are they same as epoxy molding.

Thank you!

Best Regards,
William Yeoh
Aeroteq Solutions Sdn. Bhd.
mailto:[log in to unmask]
Tel#6-04-640-3665
Fax#6-04-640-3666
Hp#6-012-477-0720


-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Matthew Tsui
Sent: 03 June 2010 05:22 PM
To: [log in to unmask]
Subject: Re: [TGAsia] Solder mask which is suitable for molding

Hi William,

Do you mean the Epoxy Molding Compound?

Regards,
Matthew Tsui
Senior Engineer
Tel : 2788 9403
Fax : 2784 4953
EPA Centre
P1408, City University of Hong Kong,
83 Tat Chee Avenue, Kln Tong, HK


On 3/6/2010 16:35, William Yeoh wrote:
> Hi,
>
> Does anyone have experience about solder mask which is suitable for
molding,
> IC molding?
>
> Thank you!
>
> Best Regards,
> William Yeoh
> Aeroteq Solutions Sdn. Bhd.
> mailto:[log in to unmask]
> Tel#6-04-640-3665
> Fax#6-04-640-3666
> Hp#6-012-477-0720
>
>
>
>
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
>    

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