Dear ..

This is QE of DEFOND Ltd. In Dong Guan city, I am Ken Yang Zhi Zhong. We are
encountering a problem that the PCB lay out solder pad ring width is just
10mils around hole and the through hole is 120mils, please see attached
photo. Such design caused the solering component (heat sink) loose easily,
solerable area is too small to fix the heat sink lead firmly. But we don't
know if such PCB hole pad design is okay, and which standard we can apply.

Thanks and best regards
Ken Yang

**********************************************************************
This e-mail and any attachments may contain information which is confidential, privileged, and proprietary or otherwise protected by law.  The information is solely intended for the named addressee (or a person responsible for delivering it to the addressee).  If you are not the intended recipient of this message, you are not authorized to read, print, retain, copy or disseminate this message or any part of it.  If you have received this e-mail in error, please notify the sender immediately by return e-mail and delete it from your computer. Our company accepts no liability for the content of this email, or for the consequences of any actions taken on the basis of the information provided, unless that information is subsequently confirmed in writing.
**********************************************************************