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June 2007

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Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Sat, 16 Jun 2007 11:07:40 +0800
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Hi Pang Min,



A.    For the method of metal impurities analysis, you can refer to

J-STD-006 and JIS Z 3910



J-STD-006A, sec 3.2.  Any analytical method can be used.

Note: Wet method is the basic one but it is impossible to implement in high

volume production in solder bar supplier so that the instrumental method

would be generally used in the supplier



JIS Z3910 -  Method of chemical analysis for solder.  It lists out the

method for different metal impurities.



Several instrumental methods are popular use  - Atomic absorption  / ICP /

Spark emission



B.      For the metal impurites spec in the solder bar, you can also refer

to J-STD-006 and JIS Z 3282,



For lead free alloy,   sometimes, you have to refer to the supplier spec as

some patent alloy has different requirement in the metal impurities control



C.    For the metal impurities control in the solder pot,  you can refer to

supplier recommendation , J-STD-002 / J-STD-003 table 3 or old IPC standard

IPC S-805A



D.    Basically, your supplier has the ability to test the metal impurites

inside the solder pot.  You can ask them for help.  If you want the third

party report, you may ask some commerical lab to support.



E.    For 63/37 alloy, the copper content control is the critical one in

addition to maintain the ratio of 63Sn /37Pb (eutectic point).  Generally,

for the stable process, the analysis of the solder every  2-3 months should

be sufficient to see the trendency .



Jackson Chan

Technical Services Manager

Cookson electronics - Alpha Metals









                                                                           

             "Pang, Min"                                                   

             <[log in to unmask]                                             

             >                                                          To 

             Sent by: TGAsia           [log in to unmask]                      

             <[log in to unmask]>                                           cc 

                                                                           

                                                                   Subject 

             2007/06/15 上午           [TGA] 关于焊锡成分分析              

             09:25                                                         

                                                                           

                                                                           

             Please respond to                                             

               Asia Committe                                               

             Task Group Forum                                              

             <[log in to unmask]>;                                             

             Please respond to                                             

                "Pang, Min"                                                

             <[log in to unmask]                                             

                     >                                                     

                                                                           

                                                                           









诸位,早上好:



向大家咨询一个关于焊锡的金属元素分析的问题。



各位是否知道,根据什么标准,对波峰焊的锡池内的焊锡的金属元素都包含什么金属

元素?



标准是多少?在哪里可以检测到这些金属元素的成分?我公司内用的焊锡Sn/Pb比例为

63/37。



或者,在您所在的公司内关于这项内容是如何控制的呢?





thanks a lot.



Best Regards!



Pang Min (Ms.) 庞敏



SV CGQ Quality Department

Siemens VDO Automotive Changchun Co., Ltd

1981, Wu Han Avenue Changchun P.R.China

130033



Tel: +86 431 84684557

Fax:+86 431 84684586

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