小郝和小段:谢谢你们的邀请.我不能去参加上海会议,但尽可能返给你们一些校对的资料.修改的不一定合适,仅供参考.
童晓明
CESI
IPC-T-50G Part 1 of 12
术语修改2部分
Analysis of Variance (ANOVA) 方差分析 91.0038
The systematic method of statistically evaluating experimental results in order to separate the sources of variation.
评价试验结果以分离变异源的系统统计方法。
▲为分离变化原因而统计性评价试验结果的系统方法。
Anchoring Spur 盘趾 22.1325
An extension of a land on a flexible printed board that extends beneath the coverlayer to assist in holding the land to the base material. (See Figure A-3.)
挠性印刷线路板上延伸至覆盖层下连接盘部分，用以加固焊盘与基材的连接。（见图A-3））
▲挠性印制板上连接盘延伸至覆盖层之下的部分，用以加固焊盘与基材的连接。
Angled Bond 角形键合 74.0039
The impression of the first and second bonds that are not in a straight line.
第一个和第二个接合压痕不在一条直线上。
▲第一个和第二个健合压痕不在一条直线上。
Anisotropic Conductive Contact 各向异性导电连接 75.0675
An electrical connection using an anisotropic conductive film or paste wherein conductive particles of gold, silver, nickel, solder, etc. are dispersed. When it is compressed, an electrical connection is attained only in the direction of compression.
用内部分布着金,银,镍,锡铅合金等导电粒子的各向异性导电膜或膏形成的电连接。当其受压时， 只在受压的方向上实现电气连接。
Anisotropy 各向异性 40.0685
The condition for a substance having differing values for properties, such as permittivity, depending on the direction within the material.
物质具有不同属性值的状况 ， 如介电常数，属性取决于材料内的方向。
Annotation 标注注释 22.0040
Text, notes, or other identification, constructed by a computer-aided system, intended to be inserted on a drawing, map or diagram.
由计算机辅助系统制作，用于在图样纸、地图图样或图表中插入的文字、注解或其他标识。
Anode (BGA) 阳极(BGA) 33.0689
The electrode from which the forward current flows within the device.
器件中的正向电流流出的电极.
Anodic Cleaning 阳极清洁洗(处理) 57.0042
Electrolytic cleaning in which the work is the anode.
工件为阳极的电解清洗。
Aperture (Stencil) 开口(网版) 73.0690
An opening in the stencil-foil.
模板薄片上的开口.
Apparent Field-of-View Angle 明视角 92.0043
The angular subtense of the field-of-view in the image space of an optical system.
在光学系统的象空间内的视场对角线.
▲ 显像视角---在光学系统的像空间内视场的对向角。.
angular. subtense（a）. 对向角是表观（显像）光源（包括漫反射）在观察者眼睛或测量点所张的视角（见最大对向角（3．49）和最小 ... 注：该定义是IEC 60050－84别的简化形式，足够本标准使用如难以确定，则应遵从IEC的定义．（这是实际对向角不是显像对向角）
Application Specific Integrated Circuit (ASIC) 专用集成电路 33.0692
A semiconductor device intended to satisfy a unique complete circuit function.
用于满足独特完整电路功能的半导体器件。
Aqueous Flux 水性助焊剂 46.0044
See "Water Soluble Organic Flux."
见“水溶性有机助焊剂。”
▲水溶性助焊剂—－
Arc Resistance 弧阻 92.0047
The resistance of a material to the effects of a high voltage, low current arc (under prescribed conditions) passing across the surface of the material. (The resistance is stated as a measure of total elapsed time at that voltage required to form a conductive path on the surface - material carbonized by the arc.)
材料对通过其表面的高压,低电流电弧(在规定条件下）所产生影响的阻抗。 (阻抗用衡量电弧电压将导体表面材料炭化形成导电通路总耗时表示。)
▲耐电弧性---材料对通过其表面的高压低电流电弧(在规定条件下)所产生影响的抵抗能力。(这种抵抗力被规定为在要求的电压下电弧碳化材料在其表面形成导电通路所耗去总时间的度量。)
Area Ratio 面积比 73.0758
The ratio of the area of aperture opening to the area of aperture walls.
开孔面积与孔壁面积之比。
▲孔开口与孔壁 面积比---孔开口面积与孔壁面积之比。
Artificial Intelligence 人工智能 11.0050
The capacity of a machine to perform functions that are normally associated with human intelligence, such as reasoning and learning.
机器能够完成通常与人类智商有关的功能的能力， 如推理及学习。
Artwork 底片 22.0051
An accurately-scaled configuration that is used to produce the "Artwork Master" or "Production Master." (See Figure A-6.)
用于生成原始底片及工作底片的精确比例图形。 (见图A-6)
▲照相底图---用于产生“照相原版”或“生产底版”的精确比例图形。
Artwork Master 原始底片 24.0052
An accurately-scaled, usually 1:1, pattern that is used to produce the "Production Master." (See Figure A-6.)
精确比例的, 通常为1:1图形，用于生成工作底片。(见图A-6)
▲照相原版---用于产生“生产底版”的通常比率为1:1的精确图形。
As-Fired 共火 45.0054
The condition (values) of thick-film components or the smoothness of ceramic base materials, after they have been processed in a firing furnace and prior to trimming or polishing.
在烧结炉中经过加工处理后并在修整或抛光前的厚膜元件的值或陶瓷基材的光滑度。
▲ 烧结后状态---经烧结炉烧结后并在刻槽或磨抛调阻前的厚膜元件的阻值或陶瓷基材的平滑度状况。
Aspect Ratio (Stencil) 纵横比(模板) 73.0808
The ratio of the width of the aperture to the thickness of the stencil-foil.
模板开口的宽度与模板厚度之比。
▲宽厚比---（下同）
Assembled Board 已组装板 80.0057
See "Assembly."
见“组装”。
▲ 组装件
Assembly 组件 80.1327
A number of parts, subassemblies or combinations thereof joined together. (Note: This term can be used in conjunction with other terms listed herein, e.g., "Printed Board Assembly.")
若干部件、次级组件或其组合相互连接连接在一起 (注: 本条术语可与其他术语连用， 如：“印刷线路板组件”。)
▲组装件---若干零部件、子组装件或将其组合在一起的结合体 (注: 本条术语可与本标准所列其他术语连用， 如：“印制板组装件”。)
注：讨论Assembly ：“组件”一词一般在元器件中多用。为在组装中不与元器件叫混，Assembly大都用“组装件”一词。
Assembly Drawing 组装图 26.1328
A document that depicts the physical relationship of two or more parts, a combination of parts and subordinate assemblies, or a group of assemblies required to form an assembly of a higher order.
描述两个或更多部件、部件和次级组装部组合、或用于形成更高等级组件所要求的一组组件的物理关系的文件.
▲描述两个或更多部件关系、部件和次级组装件的组合、或为形成更高级组装件所要求的一组组装件的文件.
Assembly Language 汇编语言 11.0058
A computer language made up of brief expressions that an assembler program can translate into a machine language.
由能将汇编程序翻译成机器语言的简单表达式组成的计算机语言。
Assembly Manufacturer 组装制造商 70.1911
The individual, organization, or company responsible for the assembly process and verification operations necessary to ensure full compliance of assemblies.
负责组装过程及必要的的检验工作，以确保产品是否完全符合要求的个人、组织或公司。
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