TGASIA Archives

June 2012

TGAsia@IPC.ORG
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Subject:
答复: [��教] 大家有�]�P於SPI �u估的��目
From:
Bliver Zhang <[log in to unmask]>
Reply To:
Bliver Zhang <[log in to unmask]>
Date:
Thu, 14 Jun 2012 02:33:21 +0000
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text/plain (1 lines) 
可以参考IPC-7527   Solder Paste Printing Acceptance Guide，该标准目前状态是最终草案供行业审查。



Bliver Zhang 张学良

Standard Supervisor 标准化主管

深圳市南山区南海大道新保辉大厦27楼 A-D

27F A-D, Xin Baohui Building, Nanhai Blvd, Nanshan District, Shenzhen

Tel: +86 755 86141218 86141219

Fax: +86 755 86141226

MP:15099906258

Skype: bliver.zhang

Email:[log in to unmask]

website: www.ipc.org.cn<https://webmail.ipc.org/owa/redir.aspx?C=310808733fc548aebe31a16138b165a0&URL=http%3a%2f%2fwww.ipc.org.cn%2f>



发件人: TGAsia [mailto:[log in to unmask]] 代表 YanQiong Wu

发送时间: 2012年6月13日 19:29

收件人: TGAsia

主题: [TGAsia] [請教] 大家有沒關於SPI 評估的項目



大家好：

               請教一下，大家有沒有評估SPI（Solder paste inspection）評估項目或標准可以參考一下？

Best regards

吳延瓊



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