TGASIA Archives

March 2011

TGAsia@IPC.ORG

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Subject:
From:
Susan Su <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 7 Mar 2011 16:01:22 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)

在 2011/03/08 之前,我离开办公室。

I will respond to your message when I return.


注意: 这是对您消息的自动答复  "[TGAsia] Graping (葡萄球焊点) effect on
solder join t" 发送日期 2011/3/7 11:40:40.

此通知是此用户离开期间您将收到的唯一通知。

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