TGASIA Archives

June 2012

TGAsia@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bohao Zhou <[log in to unmask]>
Reply To:
Date:
Thu, 7 Jun 2012 09:48:07 +0800
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (7 kB) , pic17035.gif (16 kB)
*****************************************************
太仓阿尔派电子有限公司
生产技术课:周博浩
地址:江苏太仓经济开发区广州西路1号
TEL:0512-53568111-6421
FAX:0512-53568112
E-Mail:[log in to unmask]


                                                                                                                                         
  发件人:     BOHAO ZHOU/AOTA/SPEED                                                                                                      
                                                                                                                                         
  收件人:     <[log in to unmask]>                                                                                                     
                                                                                                                                         
  抄送:       [log in to unmask]                                                                                                             
                                                                                                                                         
  日期:       2012-06-07 09:44                                                                                                           
                                                                                                                                         
  主题:       答复:  Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准                                                   
                                                                                                                                         




关于这个问题我们做了很多实验,减少和增大松香的量,增加预热的时间,提高焊接温度
和时间,但是效果都不是很明显,
也尝试过基板预烘干(这个有点效果,但不能彻底解决问题),想请问一下基板预烘干的
温度和时间一般设定为多少度烘干多长时间呢?
基板断面分析\X-RAY 也作过,但是还是没有找到真正的原因.
想请问还可以从哪些方面分析找原因呢?



                                                                                                                                         
  发件人:     <[log in to unmask]>                                                                                                     
                                                                                                                                         
  收件人:     <[log in to unmask]>                                                                                                           
                                                                                                                                         
  日期:       2012-06-07 09:05                                                                                                           
                                                                                                                                         
  主题:       Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准                                                          
                                                                                                                                         
  发件人:    TGAsia <[log in to unmask]>                                                                                                    
                                                                                                                                         






这种情况还有一种可能,波峰焊在焊接前需要喷涂flux,flux受热时会发生分解产生
气体,要是喷涂的量过大或是flux的活性过强,产生的气体来不及排除,就有可能在
焊点中产生针孔

Thanks and Best Regards

Sonic Lu 陆尚

宠辱不惊,闲看庭前花开花落
去留无意,漫随天外云卷云舒
Autoliv Electronics China (ACE) Co.,Ltd
Tel:  +86-21-67109300-3162

                                                                           
 "Yun, Xunisa (惲黎銀 IES)"                                                
 <[log in to unmask]>                                              
 Sent by: TGAsia <[log in to unmask]>                                       To 
                                              <[log in to unmask]>             
                                                                        cc 
 2012-06-06 20:07                                                          
                                                                   Subject 
                                              [TGAsia] 答复: [TGAsia] 请   
           Please respond to                  教,焊锡引脚上有空洞的原因及  
      "Yun, Xunisa (惲黎銀 IES)"              判定基准                     
     <[log in to unmask]>                                          
                                                                           
                                                                           
                                                                           
                                                                           
                                                                           
                                                                           





我们称之为吹孔,通常是由于PCB 孔壁镀铜异常造成基材膨胀产生的气体外泄所
致,以我们的经验责任判定都是属PCB供应商的,可追偿。
通常需要切片进一步分析才能得到真正原因。



Best Regards
Xunisa, Yun
EXT: 63184,MVPN:663184
MPT/IPT – Inventec Group
发件人: TGAsia [mailto:[log in to unmask]] 代表 Bohao Zhou
发送时间: 2012年6月6日 10:10
收件人: [log in to unmask]
主题: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准


请教各位专家一个问题:
基板在过完波峰焊以后,焊锡引脚上会发生空洞.
附照片:
(Embedded image moved to file: pic17035.gif)
请问产生空洞的原因会有哪些呢?另外IPC中有没有关于这方面的判定基准呢?

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________


                                                                             
 ***************************************************************             
 Consider the environment before printing this message.                      
                                                                             
 To read Autoliv's Information and Confidentiality Notice, follow this link: 
 http://www.autoliv.com/disclaimer.html                                      
 ***************************************************************             
                                                                             



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2