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March 2010

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Subject:
答复: [TGAsia] Soldering reliability test m ethod standard
From:
Leesha Peng <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Leesha Peng <[log in to unmask]>
Date:
Thu, 11 Mar 2010 20:35:20 -0600
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浩海，你好！



我知道的有：



IPC/JEDEC-9701 《表面贴装焊接连接的性能测试方法及鉴定要求》

IPC/JEDEC-9702  “MONOTONIC BEND TEST METHOD FOR SURFACE MOUNT SOLDER ATTACHMENTS“ 表面安装焊接连接单一性弯曲测试方法

IPC/JEDEC-9703 “TESTING METHODOLOGIES FOR SOLDER JOINT RELIABILITY IN SHOCK CONDITIONS FOR SMD” 震动环境下的表面安装元件焊点可靠性测试方法

IPC/JEDEC-9707 SPHERICAL TRANSIENT BEND TEST METHOD MECHENCAL CHARACTERIZATION OF PCA INTERCONNECTS and DETERMINATION OF STRAIN LIMITS” 印 制板组件互联的机械特性及应变极限瞬间球形弯曲测试方法



IPC-SM-785表面安装焊接连接的加速可靠性测试指南



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Best Regards



Leesha Peng 彭丽霞☺

General Manager 总经理，IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel: +86 21 54973435

Fax:+86 21 54973437

MP: +86 139 0299 4705

[log in to unmask]

www.ipc.org.cn



________________________________

发件人: TGAsia [[log in to unmask]] 代表 浩海 张 [[log in to unmask]]

发送时间: 2010年3月7日 13:18

收件人: Listserv TGAsia

主题: [TGAsia] Soldering reliability test method standard



Dear everyone,



Do you know which standard is about the soldering reliability test method?

Thank you!



张浩海

Alex Zhang





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