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Subject:
From:
Wen Zhong 钟文 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Wen Zhong 钟文 <[log in to unmask]>
Date:
Thu, 4 Nov 2010 17:02:39 +0800
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Dear PAUL:

      我也报名参加

Best Regards!!!
*****************************************************************************
  显示器事业部制造处工业工程部(MNT/MFG/IE/PCBA) 钟文 /kelvin
  冠捷电子(福建)有限公司/Top Victory Electronics (Fujian)Co.,Ltd
  地址(Add):中国福建省福清市元洪路上郑
  (Shangzheng,Yuanhong Road,Fuqing City,FUjian Province,P.R.China)
  邮编(Postcode):350301
  电话(Tel):+86-591-85285555-8560,传真(Fax):+86-591-85285447
  手机(Mobile):15980730668
  电邮(E-mail):wen.zhong @tpv-tech.com
  网址:http://www.tpv-tech.com
*****************************************************************************


-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 Paul Zong
发送时间: 2010年11月3日 16:40
收件人: [log in to unmask]
主题: [TGAsia] 6-10dCN 技术组招募更多成员审核IPC-9703中文版

邀请函

----6-10dCN 技术组招募更多成员审核IPC-9703中文版

6-10dCN技术组已于近日完成了IPC-9704/IPC-9702中文版的全部翻译审核工作,并即将开始IPC-9703中文版的审核工作。目前已有纬创资通、广达电脑、伟创力、华三通信、中兴公司、競陸電子、宜特电子的技术人员报名参加。
6-10dCN是关于电子组件焊接连接性能及可靠性的技术组。IPC-9703《焊点可靠性的机械冲击测试指南》是其负责开发的标准之一。
IPC-9703建立了用于评估从系统级到元器件级印制板组件焊点可靠性的机械跌落和冲击测试指南。并介绍了规定机械冲击使用条件的测试方法,和系统级、系统印制板级和元器件测试板级的测试方法,以及使用机械冲击测试试验测量方法时的有关条件和指南。
该技术组将审核、出版IPC-9703的中文版标准,并与美国的技术组共同审核、更新这项标准。
6-10dCN技术组的主席分别是早稻田大学的史洪宾先生和伟创力(珠海)的陈广民先生。

诚邀更多的技术人员及专家加入6-10dCN并参与IPC-9703中文版的审核!

联系人:史洪宾:[log in to unmask]<mailto:[log in to unmask]>
           陈广民:[log in to unmask]<mailto:[log in to unmask]>
宗云龙(该技术组联络员):[log in to unmask]<mailto:[log in to unmask]>;电话:13918552463

如您确认愿意参与IPC-9703中文版的开发,请联系宗云龙索取报名表。


Invitation
6-10dCN is recruiting more members to review IPC-9703-CN
6-10dCN has just finished the development of IPC-9704/IPC-9702 in Chinese. It will begin to translate and review IPC-9703. For the time being, the engineers from Wistron, Quanta, Flextronics, H3C, ZTE, APCB and ISTI have participated in the TG.
6-10dCN is a group related to the performance and reliability of surface mount solder attachments of electronic assemblies.IPC-9703 is one of the documents which 6-10dCN is responsible to develop.
IPC-9703 establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests.
At first, the group will translate and review the document into Chinese, at the same time, it will develop and update its new versions together with 6-10dCN in USA.
Kevin Shi from Waseda University and Johnny Chen from Flextronics undertake the Chairman of 6-10dCN.
More technicians and experts are sincerely welcome to join 6-10dCN and take participate in the development of IPC--9703!

Please contact with
Kevin Shi:  [log in to unmask]<mailto:[log in to unmask]>
Johnny Chen:[log in to unmask]<mailto:[log in to unmask]>
Paul Zong(the liaison of the TG):  [log in to unmask]<mailto:[log in to unmask]> , Mobil:13918552463

If you would like to take participate in the development of IPC-9703, please kindly contact with Paul Zong.




Best Regards

Paul Zong  宗云龙
[cid:[log in to unmask]]
IPC China
上海市谈家渡路28号盛泉大厦16AB
Suite 16AB,Shengquan Building,#28 Tan Jiadu Rd., Putuo District, Shanghai 200063 PRC
Tel:   +86 21 54973435*605
Fax:  +86 21 54973437
MP:   +86 139 1855 2463
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.ipc.org/>


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