Subject: | |
From: | |
Reply To: | |
Date: | Wed, 17 Nov 2010 09:55:57 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Borch,
I assume you are asking about ENIG.
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards recommends the use of XRF for this thickness measurement. I did not find a specific recommendation as to the preferred measurement location on the ENIG coated surface.
Best regards,
Dave
David W. Bergman 大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
Skype: davidbergmanipc
www.ipc.org
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Borch Li
Sent: Tuesday, November 16, 2010 7:58 PM
To: Listserv TGAsia
Subject: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明
Hi All,
哪位兄弟知道PCB金镍层厚度测量位置哪个IPC有说明.谢谢
Best regards&Thanks!
Multek B5 PQE
Borch Li
Legal Disclaimer: The information contained in this message may be privileged and confidential. It is intended to be read only by the individual or entity to whom it is addressed or by their designee. If the reader of this message is not the intended recipient, you are on notice that any distribution of this message, in any form, is strictly prohibited. If you have received this message in error, please immediately notify the sender and delete or destroy any copy of this message
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|