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November 2010

TGAsia@IPC.ORG

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Subject:
From:
David Bergman <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, David Bergman <[log in to unmask]>
Date:
Wed, 17 Nov 2010 09:55:57 -0600
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text/plain
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Hi Borch,



I assume you are asking about ENIG.

IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards recommends the use of XRF for this thickness measurement.  I did not find a specific recommendation as to the preferred measurement location on the ENIG coated surface.



Best regards,

Dave



David W. Bergman   大山人

Vice President, International Relations

IPC - Association Connecting Electronics Industries

3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 USA

+1 847-597-2840 tel

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Skype: davidbergmanipc

www.ipc.org



From: TGAsia [mailto:[log in to unmask]] On Behalf Of Borch Li

Sent: Tuesday, November 16, 2010 7:58 PM

To: Listserv TGAsia

Subject: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明



Hi All,

哪位兄弟知道PCB金镍层厚度测量位置哪个IPC有说明.谢谢



Best regards&Thanks!

Multek B5 PQE

Borch Li



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