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July 2008

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Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Tue, 29 Jul 2008 10:37:54 +0800
Content-Type:
text/plain
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text/plain (1 lines)
Hi Balan / Kelvin,



Agreed with Kelvin on what points should be taken when selecting the lead

free alloy.



In terms of the popluarity,  SAC305 / Sn 0.7cu / SN100 C / SACX 0307 gain

the considerable market share in wavesoldering / dipping application.  All

of them are basically compatiable to SAC alloy.







Jackson Chan

Technical Services Manager

Cookson electronics - Alpha Metals

















                                                                           

             "Qualitek"                                                    

             <qualitek@qualite                                             

             ksolution.com>                                             To 

                                       "Jackson Chan"                      

             2008/07/28 ¤U¤È           <[log in to unmask]>      

             11:21                                                      cc 

                                       "Asia Committe Task Group Forum"    

                                       <[log in to unmask]>                    

                                                                   Subject 

                                       Re: [TGA] Lead free alloy           

                                                                           

                                                                           

                                                                           

                                                                           

                                                                           

                                                                           









Hi Jackson,



Really appreciate your fast and brief input. I totally agree that there

should be

silver content to maintain the SAC characteristic as a whole.



Lately, what puzzle is the Nickel(SN100C) content which being understood

which may

contribute closer to SACX0807 compare to Tin/Cu.



Another plus point is Nickel content composition being claimed to be

substitude alloy to

be soldered with SAC alloy as an alternative. (esp. Paste is SAC305 but

Solder wire possible with

SN100C rather than even SACX due to its popularity of qualified to use as a



combination alloy with

SAC305)



So, in short what would be best explaination for SACX in comparison to

SN100C.



Thank you sir.



Rgds,

Balan







----- Original Message -----

From: "Jackson Chan" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Monday, July 28, 2008 11:28 AM

Subject: Re: [TGA] Lead free alloy





> Hi Balan,

>

>

> There is, at least,  three factors when finding the right choice of alloy

> for the particular application and product requirement

>

> 1. Cost

>

> 2. Performance (e.g. hole-fill at wavesoldering process)

>

> 3. Reliability (Thermal cycle, drop shock etc)

>

>

> Just in terms of raw material cost, tin / copper alloy should be the

> cheapest one.  The addition of silver would add the cost.  However, it is

> not the "only" criteria when selecting the alloy as indicated above.

>

> High silver alloy is proved to have the good reliability in terms of

> thermal cycle test comparing to tin / copper alloy.  However, the cost is

> considerable.  As a result, certain balance point when considering the

> above three factors as a whole.  Therefore, the silver content is needed

> to

> lower but still satisfy the performance and reliability requirement.

> SACX0807 (Silver 0.8%, 0.7% copper) is one of the choice when considering

> the product which is needed to meet these factors

>

> Jackson Chan

> Technical Services Manager

> Cookson electronics - Alpha Metals

>

> Low cost, reliable alloy- SACX0807

>

>

>

>

>             "Qualitek"

>             <qualitek@qualite

>             ksolution.com>                                             To

>                                       "Asia Committe Task Group Forum"

>             2008/07/27 ¤U¤È           <[log in to unmask]>, "Jackson Chan"

>             10:01                     <[log in to unmask]>

>                                                                        cc

>

>                                                                   Subject

>                                       Re: [TGA] Immersion gold thickness

>                                       enquiry

>

>

>

>

>

>

>

>

>

>

>  Hi Jackson,

>

>  Using SACX0807, will this become best choice to replace SN100C in terms

> of

> both

>  1)Pricing

>  2)Joint finishing compare to SAC305

>

>  Appreciate your sharing on the above matter.

>

>  Rgds,

>  Balan

>

>

>

>

>

>




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