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August 2011

TGAsia@IPC.ORG

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Subject:
From:
Rocky Wang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Rocky Wang <[log in to unmask]>
Date:
Mon, 15 Aug 2011 10:28:23 +0800
Content-Type:
text/plain
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text/plain (1 lines)
Dear Wellington:
     谢谢回复.具体为现有PCB供应商制作PCB时, 我们的PCB设计要求,已经触及了PCB supplier的制造能力极限, 如 VIA 设计:8*13.5mil (via and Pad), 而通常为8*16 mil.


Best Regards
Rocky


-----Original Message-----
From: Wellington Li [mailto:[log in to unmask]] 
Sent: Thursday, August 11, 2011 4:45 PM
To: Asia Committe Task Group Forum; Rocky Wang
Subject: 答复: PCB 设计

Dear Rocky 

    首先需要确认一下,是现有供应商做BGA产品有难度?还是因为报价等原因,供应商没办法按照合理工艺、材料进行生产?
    另外,产品可靠性等要求,接收标准等均没有明确说明。一般人是不好报价给你的。
    从给的技术条件来看,似乎没有特别难度。    

Best regards,

Wellington Li   李永江
Assessor 
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-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 Rocky Wang
发送时间: 2011年8月11日 16:14
收件人: [log in to unmask]
主题: [TGAsia] PCB 设计

大家下午好:
    现在公司有个产品(6layers),现有的PCB供应商似乎做起来有些困难.
    1. BGA Via design 8*13.5mil (via and Pad),BGA pitch:0.65mm
    2. 3.5mil for Trace/Space, and 1HOZ copper foil is used for inner layer
    基于成本及PCB可制造性考虑, 大家有什么建议呢?

    另外询问大家所接触的PCB供应商有哪些,相对来说制造能力要强一些的.

Best Regards
Rocky

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