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August 2011

TGAsia@IPC.ORG
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Subject:
PCB 设计
From:
Rocky Wang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Rocky Wang <[log in to unmask]>
Date:
Thu, 11 Aug 2011 16:14:00 +0800
Content-Type:
text/plain
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text/plain (1 lines) 
大家下午好:
    现在公司有个产品(6layers),现有的PCB供应商似乎做起来有些困难.
    1. BGA Via design 8*13.5mil (via and Pad),BGA pitch:0.65mm
    2. 3.5mil for Trace/Space, and 1HOZ copper foil is used for inner layer
    基于成本及PCB可制造性考虑, 大家有什么建议呢?

    另外询问大家所接触的PCB供应商有哪些,相对来说制造能力要强一些的.

Best Regards
Rocky

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