您好！

   对于潮湿敏感和需要回流焊的器件，也可以参考一下IPC的J-STD-020C：

《Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State

Surface Mount Devices》

Table 4-1 SnPb Eutectic Process – Package Peak Reflow Temperatures

Table 4-2 Pb-free Process – Package Classification Reflow Temperatures



    以上仅供参考



贾变芬

ZTE







                                                                           

             johnson zhao                                                  

             <[log in to unmask]                                             

             OM>                                                    收件人 

             发件人:  TGAsia           [log in to unmask]                      

             <[log in to unmask]>                                         抄送 

                                                                           

                                                                      主题 

             2008-01-05 09:59          Re: [TGA] 元器件焊接溫度的訂定      

                                                                           

                                                                           

                 请答复 给                                                 

               johnson zhao                                                

             <[log in to unmask]                                             

                    om>                                                    

                                                                           

                                                                           









您好!

  一般元件生产厂家都会提供器件的最大承受温度和时间,实际在焊接时所采用的最佳

温度的设定,您需要考虑您使用的设备功率\焊接头的大小\焊接区域的大小\形状(热容

大小)还有器件的最大承受温度等综合考虑,并通过实验才能得到贵司生产该产品时的

最佳温度和焊接时间.总之在最低的温度和最短的时间内完成焊接工作,并得到良好的

焊接效果,才是最好.

  目前,所谓的推荐的温度和焊接时间主要是参考目前所使用的60W\M型手柄得到焊接

温度,仅作参考而已.

Best Regarts!

赵松涛

2008-1-5

深圳市易思维科技有限公司





 ----- Original Message -----

 From: rock

 To: [log in to unmask]

 Sent: Friday, January 04, 2008 5:30 PM

 Subject: [TGA] 元器件焊接溫度的訂定



 我司在生產中遇到一些困擾，因為很多元器件規格書上沒有焊接溫度要求，而我們現

 行是靠試驗去確定最佳焊接溫度，請問是否有相關標準去規定不同元件應使用多少的

 溫度焊接？



 饒展鵬









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