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August 2009

TGAsia@IPC.ORG
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Subject:
答复: Tacky flux for BGA rework
From:
James Liu <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, James Liu <[log in to unmask]>
Date:
Fri, 7 Aug 2009 00:06:36 -0500
Content-Type:
text/plain
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text/plain (1 lines) 
Hi LP,

I had ever translated a paper on rework of mirror BGA design. In this paper, some tests had shown that tacky flux was not good for mirror BGA and adjacent companies. You can find this paper from our newsletters this year.





Best Regards,



James Liu 刘春光

Director, Technology & Standardization 技术与标准总监

IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel:   +86 21 5497 3435

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________________________________

发件人: TGAsia [[log in to unmask]] 代表 LP Koay [[log in to unmask]]

发送时间: 2009年8月7日 10:08

收件人: Listserv TGAsia

主题: [TGAsia] Tacky flux for BGA rework



Hi All,



What is the benefit of using tacky flux for BGA rework compare to solder paste? Do you have any technical paper to share?



Thanks,

LP

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