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November 2010

TGAsia@IPC.ORG

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Subject:
From:
Lewis Liu <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Lewis Liu <[log in to unmask]>
Date:
Sat, 20 Nov 2010 20:46:41 +0800
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有具体的活动内容清单吗?

Lewis Liu (刘定豪)
Engineering Department   
Failure Analysis laboratory Supervisor 
Tel:+86 -25- 52728710
Cell:+86 -25 -13851527451
Mail:  [log in to unmask]
Kimball Electronics (Nanjing) Co.,Ltd

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charlotte "Yu" Hao
Sent: Friday, November 19, 2010 6:08 PM
To: [log in to unmask]
Subject: [TGAsia] 答复: [TGAsia] IPC是否有关于阻焊涂覆厚度要 求?

IPC-SM-840

NEW:2011年3月14日至18日上海CEMAC众多技术活动期待您参与!

Hao Yu   郝 宇
IPC
________________________________________
发件人: TGAsia [[log in to unmask]] 代表 Bingzhi Li [[log in to unmask]]
发送时间: 2010年5月25日 19:26
收件人: Listserv TGAsia
主题: [TGAsia] IPC是否有关于阻焊涂覆厚度要求?

PCB制作过程,绿油涂覆不均匀,造成PCB板面的不平整。

请教各位,IPC是否有相关的标准定义阻焊涂覆厚度?包括VIA的绿油塞空。

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