Dear Jeff 
    1 好像PCB孔径设计与LED插脚不太匹配
    2 焊接锡丝只有0.8，偏细；
    3 主要问题集中在LED弯角下，可考虑选择低松香含量锡丝或者适当延长焊接时间
    4 是否PCB孔壁品质问题，需要更清晰图片支持；焊接前预烤是好的预防，但正常情况下可以不用。

Best regards

Wellington Li 李永江
Assessor  审核员
British Standards Institution 英国标准协会

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-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 Jeff Chen
发送时间: 2013年5月9日 12:20
收件人: [log in to unmask]
主题: [TGAsia] Soldering bubble problem root


Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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