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May 2013

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Jessie GUO <[log in to unmask]>
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Jessie GUO <[log in to unmask]>
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Mon, 20 May 2013 07:45:29 +0000
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致:国际电子工业联接协会的朋友们:



        [cid:[log in to unmask]]





IPCWorksAsia2013

 技术交流会

论文征集函



时间:2013年10月

地点:深圳



向电子行业的工程师、经理、高层管理人员分享您的专业知识!

将电子行业的目光聚焦到您的研究和创新成果!

搭建最优质的舞台,提升您个人和贵司知名度!



IPCWorksAsia是由IPC-国际电子工业联接协会®在华南地区举办的,业内最具影响力和前瞻性的大型综合性技术研讨会。内容从行业的未来发展到最新技术和创新理念,主题涉及电子产业链的各个环节,听众覆盖国内外业内意见领袖、专家、公司决策者、技术研发人员等。

论文议题范围

包括设计、材料、组装、工艺、设备等领域(不限于):

²  粘合剂

²  PCB制造

²  挠性电路

²  面阵列/倒装芯片/0201

²  特性、质量和可靠性

²  BGA封装

²  印刷电子

²  HDI技术

²  业务和供应链问题

²  焊接

²  无铅制造、组装和可靠性

²  敷形涂料、

²  测试、检验和AOI

²  设计

²  电迁移

²  封装和组件

²  嵌入式有源和无源器件



²  环保合规

²  先进技术

²  PCB和元器件存储及处理

²  枕形不良、元器件和电路板翘曲

²  组装和返工工艺

²  精益6 Sigma

²  黑焊盘及其它电路板问题

²  RFID电路

²  高速、高频及信号完整性

²  BTC/QFN/MLF

²  表面处理

²  微型化

²  锡须

²  底部填充胶

²  塞孔及其它保护

²  电子制造服务

²  POP





技术论文提交注意事项



Ÿ   技术论文主题及内容必须为纯技术论文或应用论文,不得涉及公司或产品宣传等商业内容,所有论文需经IPC中国技术项目委员会审核后最终决定是否录用;

Ÿ   每篇演讲限制在35分钟之内,包括5分钟左右的听众问答时间;

Ÿ   超过1.5个小时的技术内容,将被专设为讲座,请在提交时注明讲座;

Ÿ   所有经过IPC中国技术项目委员会审核通过的演讲,免费;

Ÿ   没有通过IPC中国技术项目委员会审核的题目,可以选择参加赞助演讲;

Ÿ   会议官方语言为中文,英文演讲请自带翻译,PPT为中文;

Ÿ   论文演示文稿、演讲人介绍将被统一收录到会刊中,并放在IPC中文网站上供大家查阅;

Ÿ   请填写《演讲内容确认表》(另附),提交中、英文论文摘要(约300字)、演讲人简介(100字左右)、公司简介(100字左右)及照片。

Ÿ   论文征集截止时间:2013年8月1日;

Ÿ   PPT提交截止时间:2013年8月20日;

演讲裨益

Ÿ   IPC将为演讲人颁发杰出贡献奖证书和礼物;

Ÿ   提升演讲者本人在业界的知名度;

Ÿ   提升贵公司在业界的形象和影响力;

   现在报名!

论文摘要提交及报名咨询,请联系IPC大中华区标准技术总监刘春光先生,

电邮:[log in to unmask]<mailto:[log in to unmask]>,电话:021-2221 0101。

详情登陆IPC中文网站:www.ipc.org.cn<http://www.ipc.org.cn>









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To All Friends of IPC:



        [cid:[log in to unmask]]





IPCWorksAsia2013

          Call for Papers!





Date: Aug. ,2013

City: Shenzhen

Share your expertise with engineers, managers, and executives in electronics industry.

Shine the industry spotlight on your research and innovations.

Bring yourself &your company to the industry forefront through a very cost-effective channel.



IPCWorksAsia is premier conference which is held annually by IPC in South China. Speech contents cover all segments of electronics industry supply chain. And attendees come from key engineers, managers, and executives from all segments of electronics interconnection industry in China.



Conference Topics

Expert presentations are welcome on design, materials, assembly, processes, and equipment in the following area:

²  Adhesives

²  PCB Fabrication

²  Flexible Circuitry

²  Area Array/Flip Chip/0201

²  Performance, Quality & Reliability

²  BGA Packaging

²  Printed Electronics

²  HDI Technologies

²  Business & Supply Chain Issues

²  Soldering

²  Surface Finishes

²  Conformal Coating

²  Test, Inspection & AOI

²  Design

²  Electromigration

²  Packaging & Components

²  PoP



²  Environmental Compliance

²  Advanced Technology

²  PCB and Component Storage& Handling

²  Head-in-Pillow, Component &Board Warpage

²  Assembly and Rework

²  Lean 6 Sigma

²  Black Pad and other Board Issues

²  RFID Circuitry

²  High Speed, High Frequency & Signal Integrity

²  BTC/QFN/MLF

²  Lead Free Fabrication, Assembly & Reliability

²  Microminiaturization

²  Tin Whiskers

²  Underfills

²  Via Plugging & Other Protection

²  Electronics Manufacturing Services

²  Embedded Passive and Active Components





Requirements of Technical Paper Submission

Ÿ   The paper should be technical or applied not commercial. The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess contents of the proposed paper.

Ÿ   Presentations will be limited to35 minutes including approximately 5 minutes for questions and answers.

Ÿ   Presentations above 1.5 hours are encouraged to submit to workshops.

Ÿ   Selected paper by the Technical Program Committee will be free for presentation.

Ÿ   If unselected, has the opportunity to apply for sponsor speech.

Ÿ   The conference language is Chinese. English speakers have to bring interpreters by themselves. And presentation slides will be in Chinese.

Ÿ   All presentations and speakers’ biography will be included in conference proceedings and put on IPC CN website for sharing.

Ÿ   Please fill in the firm of Speech Confirmation Form (Attached), with abstract of approximately 300 words and speaker biography of approximately 100 words, and company profile of 100 words.

Ÿ   The deadline for abstracts is Aug. 1st, 2013.

Ÿ   The deadline for presentation slides is Aug. 20th, 2013.

Conference benefits

Ø  Conference speakers will be presented for “ Distinguished Contribution Award”  and gift from IPC.

Ø  Enhance professional image in the industry.

Ø  Enhance the corporate awareness in the industry.

Action now!

Submission or for more conference participation, please contact James Liu, Standards and Technical Director at IPC Greater China , at [log in to unmask],Tel<mailto:[log in to unmask],Tel>: 021-2221 0101。 .

For more detail, click the following linkwww.ipc.org.cn<http://www.ipc.org.cn>



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