个人认为：“电路板在手工焊接完插件后，焊点周围很脏，不知如何避免这个现象。我们使用的是免清洗焊锡丝”，这个问题不能简单认为允许，这个要分情况：如果很脏，需要处理，可以通过清洗补救，注意不要造成二次污染；当然，手工焊接一定会比波峰焊差些，这也是客观存在。
       要提高手工焊接质量，加强员工培训，控制焊接时间和温度；根据不同的插件引脚大小选择焊枪；另外对焊锡丝也要有要求；对器件、PCB板注意防氧化等，不能一盖而论。
  供参考！
浙江华立国际发展有限公司
营运审计部   陈智东
联系电话：0571-88900636
QQ：653743967
  厚 德 载 物
----- Original Message ----- 
From: "James Liu" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 28, 2010 9:17 AM
Subject: [TGAsia] 答复: [TGAsia] 请教：手工焊接问题


> IPC-A-610D中有说法。免洗助焊剂残留允许存在。
> 
> 
> 
> 
> Best Regards,
> 
> NEW：10月25-29日深圳 IPCWorks Asia众多技术活动期待您参与！
> 
> James Liu 刘春光
> Director, Industry Programs 工业项目总监
> IPC China
> 
> 
> 北京市经济技术开发区宏达北路18号大地国际大厦407A
> Suite 407A，Dadi international Building, #18 Hongda North Rd., BDA 100176 Beijing China
> Tel:   +86 10 67885326
> Fax:  +86 10 67885326
> MP:   +86 136 0133 3491
> [log in to unmask]
> www.ipc.org.cn
> 
> -----邮件原件-----
> 发件人: TGAsia [mailto:[log in to unmask]] 代表 Wen Zhong 钟文
> 发送时间: 2010年9月28日 8:51
> 收件人: Listserv TGAsia
> 主题: [TGAsia] 答复: [TGAsia] 请教：手工焊接问题
> 
> Dear all:
> 
>       我们工厂也有这样的问题，是很正常的现象，焊点周围比波峰焊形成的焊点周围要“脏”，但是允收的，不用清洗。
> 
>      不过最好你要弄个图片出来大家参考一下。
> 
> Best Regards!!!
> ***************************************************************************
> 显示器事业部制造处工业工程部（MNT/MFG/IE/PCBA)  /kelvin.zhong
> 冠捷电子（福建）有限公司/Top Victory Electronics (Fujian)Co.,Ltd
> 地址(Add)：中国福建省福清市元洪路上郑
> (Shangzheng,Yuanhong Road,Fuqing City,FUjian Province,P.R.China)
> 邮编(Postcode)：350301
> 电话(Tel)：+86-591-85285555-8560，传真(Fax)：+86-591-85285447
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> 电邮(E-mail)：wen.zhong @tpvaoc.com
> 网址：http://www.tpvaoc.com
> ***************************************************************************
> 
> -----邮件原件-----
> 发件人: TGAsia [mailto:[log in to unmask]] 代表 Yong Qin Tang
> 发送时间: 2010年9月28日 8:37
> 收件人: [log in to unmask]
> 主题: Re: [TGAsia] 请教：手工焊接问题
> 
> Hello,
> 这个问题是正常的，焊料焊接完，焊点周围出现碳化的残渣，这是由于助焊剂被高温碳化后留下的，免清洗只是说明焊料中固体颗粒物少于高残留或较多残留而已，残留物还是需要用允许清洗剂在焊接结束后进行清洗，不然这些残留同样会造成测试、使用时的不稳定……
> 
> Yongqin.
> 
> Sh.flextronics
> 
> -----Original Message-----
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of YIN Zhaohong
> Sent: 2010年9月27日 16:48
> To: [log in to unmask]
> Subject: [TGAsia] 请教：手工焊接问题
> 
> 大家好
> 
> 电路板在手工焊接完插件后，焊点周围很脏，不知如何避免这个现象。我们使用的是免清洗焊锡丝。
> 
> 
> 
> 
> 
> 尹朝洪
> 
> 
> 
> 
> 
> -----邮件原件-----
> 发件人: TGAsia [mailto:[log in to unmask]] 代表 Paul Zong
> 发送时间: 2010年9月15日 10:37
> 收件人: [log in to unmask]
> 主题: Re: [TGAsia] 请教 PCB包装问题！
> 
> 
> Dear Alphy:
>    您好，1601这本标准是IPC的收费标准需要购买，而伟创力集团作为IPC的会员公司是可以对该标准进行免费下载的。您可以通过这个途径去获得1601标准的完成版，谢谢。
> Best Regards
> 
> Paul Zong  宗云龙
> 
> 
> 
> 
> -----Original Message-----
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of Alphy Lin
> Sent: 2010年9月15日 8:42
> To: Listserv TGAsia
> Subject: Re: [TGAsia] 请教 PCB包装问题！
> 
> Dear All,
> 
> 请问谁有最新的1601标准，请帮忙共享一下4.2.3和4.2.4的内容，是否必须有干燥剂和湿度指示卡。我们目前与PCB制造商在PCB包装方法上存在一些争议。
> 
> Thanks
> 
> Flextronics Electronics Technology (Shenzhen) Co., Ltd.
> TEL       : +86 755 2731 4188 (ext 8986)
> Mobile : +86 18923779532
> FAX       : +86 755 2731 4189
> E-mail    :  [log in to unmask]
> ☆ Creating Value That Increases Our Customer's Competitiveness ☆ -----Original Message-----
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of Paul Zong
> Sent: Thursday, September 09, 2010 10:04 AM
> To: [log in to unmask]
> Subject: Re: [TGAsia] 请教 PCB包装问题！
> 
> Hi  Mainer:
> 在IPC最新出版的1601标准中有你所需要的内容。作为会员公司你可以发送邮件至[log in to unmask]<mailto:发送给[log in to unmask]>，进行该标准免费电子版的申请. http://www.ipc.org/TOC/IPC-1601.pdf 是该标准的目录。以下是1601的内容介绍供你参考。
> 
> IPC-1601<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=806377ad-9cb6-df11-a831-002219545fd5>  Printed Board Handling and Storage Guidelines The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability. 18 pages.
> 
> Best Regards
> 
> Paul Zong  宗云龙
> [cid:[log in to unmask]]
> IPC China
> 上海市谈家渡路28号盛泉大厦16AB
> Suite 16AB，Shengquan Building，#28 Tan Jiadu Rd., Putuo District, Shanghai 200063 PRC
> Tel:   +86 21 54973435*605
> Fax:  +86 21 54973437
> MP:   +86 139 1855 2463
> [log in to unmask]<mailto:[log in to unmask]>
> www.ipc.org<http://www.ipc.org/>
> 
> 
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of Mainer Zhou
> Sent: 2010年9月9日 9:31
> To: Listserv TGAsia
> Subject: [TGAsia] 请教 PCB包装问题！
> 
> Hi all,
>   请问各位，有谁手上有PCB 的包装的要求，如，在包装PCB时，是否需要有无油纸，或是否一定要有干燥剂等。
>   另外，PCB 若既没有无油纸，又没有放置干燥剂时，一般的储存条件和时间是多久。
> 
> Best Regards,
> Mainer Zhou
> Quality Engineer, Ingenico
> Flextronics Technology (Shanghai) Co.,Ltd.
> Address: No.77 Yong Sheng Rd., Malu Jiading Shanghai China, 201801
> CDMA: 15316700220
> Mobile: 021-13916096640
> Direct: 021-39158131
> Main: mainer [log in to unmask]<mailto:[log in to unmask]>
> 
> 
> Legal Disclaimer: The information contained in this message may be privileged and confidential. It is intended to be read only by the individual or entity to whom it is addressed or by their designee. If the reader of this message is not the intended recipient, you are on notice that any distribution of this message, in any form, is strictly prohibited. If you have received this message in error, please immediately notify the sender and delete or destroy any copy of this message ______________________________________________________________________
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