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January 2007

TGAsia@IPC.ORG

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From:
Leesha Peng <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Leesha Peng <[log in to unmask]>
Date:
Tue, 16 Jan 2007 22:18:10 -0600
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 (Solder)  可能不是 (焊接), 有没有可能是(焊料)?   
to be wetted 语法上有将要的意思, "要被焊料润湿的(underlying?)金属表面, 也称为(basis metal)
中文措辞上是否需要区别base和basis?
 
 
Leesha Peng 彭丽霞
技术与培训部总监 
Director Technical and Training Program
IPC WOFE, a subsidiary of IPC, Inc.
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上海市宜山路711号
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________________________________

From: TGAsia 代表 Katja Sha
Sent: 2007-1-15 (星期一) 1:56
To: [log in to unmask]
Subject: Re: [TGA] 关于可移动的助焊剂结晶



The PCB design engineer is saying that : " it is  the surface finish -  immersion tin for PCB " . 
so , it should be the Tin on the copper layer gets wetted by solder. 

我个人认为应该理解为“锡”。 

Regards 

Katja Sha 





tongxm <[log in to unmask]> 
Sent by: TGAsia <[log in to unmask]> 

2007-01-15 14:37 
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
tongxm <[log in to unmask]>


To
[log in to unmask] 
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Subject
Re: [TGA] 关于可移动的助焊剂结晶	

		




(上信中打字错误:将“锡”字打成“铝”,特此更正为“锡”字。) 
      请讨论:下面的文字"The underlying metal surface "是指锡还是铜焊盘? 
  
Base Metal (Solder)                         基底金属 (焊接)    46.1491 
The underlying metal surface to be wetted by solder, also referred to as basis metal. 
被焊料浸润的下层金属表面,也成为基底金属。 


童晓明 
CESI 
  
  
  
谢谢! 
  
  
  



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