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| Date: | Mon, 8 Nov 2010 15:29:49 +0900 |
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Hi Tim,
"IPC J-STD-030 Guideline for Selection and Application of Underfill
Material for Flip Chip and other Micropackages" suggests that voids or
discontinuities as small as 13 ¦Ìm may be detected, contingent upon the
frequency of operation(C-SAM) and the sample design.
FYR!
2010/11/8 Tim Deng <[log in to unmask]>:
> Anybody know the acceptance criteria on ¡°void¡± defect in underfill process?
> IPC-A-610 D @ item 8.2.12.5 mentioned the underfill but it seems it is not
> very clear to state ¡°void¡±.
>
>
>
> B.regards
>
> Tim Deng
>
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--
Best Regareds!
SHI Hongbin (Ê· ºéÙe)
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