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----B-10aCN 技术组招募成员

B-10aCN技术组即将问鼎IPCTGAsia。它将主要开发被业界广泛采用的三项有关湿敏元器件的标准。

● 《J-STD-020 非密封固态表面贴装器件湿度/再流焊敏感度分类》

● 《J-STD-033 湿度/再流焊敏感表面贴装器件的处置、包装、运输及使用》

● 《J-STD-075 组装工艺中非IC电子元器件的分类》

其中J-STD-020提供了对湿敏元器件的测试方法及分类标准；J-STD-033提供了湿敏元器件的处置、包装、运输及使用方法；而J-STD-075则给出了在锡铅及无铅工艺的最坏条件下非半导体电子元器件的组装工艺限值。

该技术组将首先翻译、审核、出版这三项标准的中文版，并与美国的技术组共同审核、更新这些标准。



 来自深圳易瑞来科技开发有限公司的吴波将担任B-10aCN的主席。



诚邀更多的技术人员及专家积极加入B-10aCN！



联系人：郝宇： [log in to unmask]<mailto:[log in to unmask]>；电话：13823187909

吴波： [log in to unmask]<mailto:[log in to unmask]>



Invitation

B-10aCN is recruiting members

B-10aCN will be coming soon, which will focus on three IPC standards about  nonhermetic solid state surface mount devices (SMDs).

● 《J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices》

● 《J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices》

● 《J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes》

J-STD-020 identifies the classification level of nonhermetic solid state surface mount devices (SMDs).

J-STD-033 provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-020.

J-STD-075 outlines worst case industry solder (SnPb and Pb-free) assembly process limits for non-semiconductor electronic components (hereafter referred to as ‘‘components’’) along with commodity specific exceptions to the worst case solder assembly process limits.

At first, the group will translate and review the three documents into Chinese, at the same time, it will develop and update their new versions together with B -10a in USA.



Wu Bo undertakes the Chairman of B-10aCN, who is from Shenzhen Erelia Technologies Co., Ltd..



More technicians and experts are sincerely welcome to join B-10aCN!



Please contact with Hao Yu:  [log in to unmask]<mailto:[log in to unmask]>,  Mobil: 13823187909

                                   Wu Bo:  [log in to unmask]<mailto:[log in to unmask]>











Hao Yu  郝宇

Technical Resource Coordinator

IPC China

深圳市南山区高新科技园南区科技南十二路方大大厦1807室

Rm 1807, Fangda Bldg, 12th South Keji Road

Hi-Tech Park, Nanshan District, Shenzhen

Tel：+86 755 86141218/86141219

MP：+86 138 2318 7909

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