是的，在这里我们属于一个团队需要遵守论坛上面的一切规章制度

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charlotte Hao
Sent: Tuesday, August 21, 2007 10:59 AM
To: [log in to unmask]
Subject: [TGA] 关于关闭附件功能的说明

 
大家好!
 
非常感谢一直以来各位专家对IPC的关注和支持。
 
由于一再出现违反论坛使用原则, 在苏州APCC的一位注册成员附上IPC某项标准全文后, 我们关闭了附件功能. 并且在相当一段时间内不会开通。
我们设立这个论坛是为大家提供一个平台互相交流互相认识, 新注册成员都会收到欢迎信, 其中明确说明了需要大家共同遵守的原则, 现将相关段落复述如下：

...

未经IPC同意不向第三方提供IPC的技术文件和/或您翻译的IPC技术资料。当您向IPC提供任何工业实践经验和数据，您须确认是经过产权所有者授权您这样做。IPC对于因为您提供的未经授权的技术资料造成的任何知识产权纠纷将不承担责任。

...

我们希望引起大家足够的重视，然后考虑在适当的时候恢复附件功能。

祝各位工作愉快!

Leesha Peng 彭丽霞
标准开发/设计课程与技术资源项目总监 
Director, Standards/Design Programs
& Technical Resources 
上海市延安西路1088号2303室
邮编：200052
手机:13902994705

 



----- Forwarded by ShiBo Su/QA/KFSU/GWKAIFA on 2007-07-19 17:09 ----- 



Hi Experts in TGA, 

I would like to raise a question here on Chip component open solder, and appreciate your help to reply my concern why "chip component open soder on side" can not be accepted. What is the IPC concern when draft the standard on this type failure? Is there any pontential risk if give greenlight on chip component open solder since it already pass ICT and FCT test. 

I want to show you the picutures, but the system now is configured with the function to reject mails with attachment and photos,so pls. refer to the figure 8-27 from IPC-A-610D in page 8-19. 

Regards. 





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