TGASIA Archives

November 2006

TGAsia@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, tongxm <[log in to unmask]>
Date:
Fri, 1 Dec 2006 09:47:14 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Dear Leo ,



1, About the meeting:

If no any especial problem I’ll participate in the meeting held in Dongguan city.

Tong Xiaoming (童晓明)



CESI





2, About the term and definition:

Only as a opinion:

Die Shrink 芯片缩小 



Method of reducing silicon area used for the same circuitry by reducing layout feature size by a common percentage for all levels. 



按照相同比例,通过减小同一电路各层布局要素尺寸的大小,减小同一电路所用硅片面积的方法。



▲通过按同一百分数减小整个范围版图特征尺寸来减小同样电路用硅片面积的方法。



Tongxm

童晓明

CESI






ATOM RSS1 RSS2