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December 2010

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Subject:
答复: 继电器抬高
From:
James LIU Chunguang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, James LIU Chunguang <[log in to unmask]>
Date:
Fri, 24 Dec 2010 01:02:57 -0600
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text/plain
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text/plain (1 lines) 
请参考IPC-A-610E的7.1.6









Best Regards,



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James Liu 刘春光

Director, Industry Programs 工业项目总监

IPC China

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发件人: TGAsia [mailto:[log in to unmask]] 代表 Lu Zhengqiang (RBAC/MOE2.4-AE)

发送时间: 2010年12月24日 14:37

收件人: Listserv TGAsia

主题: [TGAsia] 继电器抬高



Hello, all,

        关于继电器有抬高的问题，我们应该参照IPC-A-610D中的那一章节的标准？

        备注：我们使用3级标准， 图示中引脚焊接有完全伸出PCB焊接孔， 填充深度超过75%， 引脚和孔壁的填充润湿超过330度。

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BR

Lu











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