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August 2009

TGAsia@IPC.ORG

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Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Wed, 12 Aug 2009 09:09:25 +0800
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (3469 bytes) , pic02470.jpg (43 kB)
Hi Zhengqiang



I would suggest you to make analysis whether it is solder or other metal or

even other thing.  You can use EDX to analyze whether it contains metallic

component.



In some case, it is just the fibre from board or other source (e.g rosin)



Jackson Chan

Technical Services Manager

Cookson electronics - Alpha Metals





                                                                           

             "Lu Zhengqiang                                                

             (RBAC/MOE2.4-AE)"                                             

             <Zhengqiang.Lu@CN                                          To 

             .BOSCH.COM>               [log in to unmask]                      

             Sent by: TGAsia                                            cc 

             <[log in to unmask]>                                              

                                                                   Subject 

                                       [TGAsia] Help                       

             2009/08/11 ¤U¤È                                               

             04:51                                                         

                                                                           

                                                                           

             Please respond to                                             

               Asia Committe                                               

             Task Group Forum                                              

             <[log in to unmask]>;                                             

             Please respond to                                             

              "Lu Zhengqiang                                               

             (RBAC/MOE2.4-AE)"                                             

             <Zhengqiang.Lu@CN                                             

                .BOSCH.COM>                                                

                                                                           

                                                                           









Hello, Everyone,

            Here we meet a solder bridge after reflow, see attached

picture, but the bridge is very strange, only a filament, do you ever meet

this kind of bridge? How it could happen?



(Embedded image moved to file: pic02470.jpg)





Thanks & Best Regards

_______________________

BeQIK

Zhengqiang Lu (Mr.)

RBAC/MOE2.4-AE



Tel.      +86(512)6767 5768

Fax.     +86(512)6256 5236

100 Years

Bosch in China | 1909-2009

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