TGASIA Archives

May 2013

TGAsia@IPC.ORG

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Subject:
From:
Patrick Mak <[log in to unmask]>
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Date:
Mon, 13 May 2013 09:52:15 +0800
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Hi,

I don't want to receive any emails regarding to this "question and answer"
mails. Can you delete me from the list? Thank you!

Best regards,
Patrick Mak 

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jeff Chen
Sent: Thursday, May 09, 2013 12:20 PM
To: [log in to unmask]
Subject: [TGAsia] Soldering bubble problem root


Dear All,

One of my customer feedback the bubble problem when soldering. The defective
sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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