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| Date: | Wed, 1 Nov 2006 11:04:22 +0800 |
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bonding是否也称“引线键合”
如有任何意见和建议，请和我联系！
谢谢！
贾变芬
电话：内线 1603 外线 26771603
传真：26771091
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| | zgfeng |
| | <[log in to unmask]
| | CN> |
| | 发件人： TGAsia |
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| | 2006-11-01 11:13 |
| | 请答复 给 Asia |
| | Committe Task |
| | Group Forum; 请答|
| | 复 给 zgfeng |
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| 收件人： [log in to unmask] |
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| 主题： [TGA] Re: (瑞星提示-此邮件可能是垃圾邮件)[TGA] Today's terms |
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Metallized Land Areas 金属化焊盘区域 22.1756
A pattern of conductive material used on a substrate to interconnect
electronic components. Widened conductor areas used as attachment point for
wire bonding or other devices.
基板上用以实现电子元件互连的导电材料图形。加宽的导体区域用作导线邦定或其他
器件的连接点。
----- Original Message -----
From: "Charlotte Hao" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 31, 2006 11:19 AM
Subject: (瑞星提示-此邮件可能是垃圾邮件)[TGA] Today's terms
Dear All,
Today there are two terms which are uncertain, would you like to help us?
Thanks and regards
Charlotte
Metal Migration 金属迁移
96.1445
The electrolytic transfer of metal ions along an electrically conductive
path from one metal surface to another when an electrical potential is
applied to the two metal surfaces.
当电压作用于两个金属表面时，金属离子在电解作用下通过电气导电通路从一金属表
面迁移到另一金属表面。
Metallized Land Areas 金属化焊盘区域 22.1756
A pattern of conductive material used on a substrate to interconnect
electronic components. Widened conductor areas used as attachment point for
wire bonding or other devices.
基板上用以实现电子元件互连的导电材料图形。加宽的导体区域用作导线绑定或其他
器件的连接点。
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