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Subject:	Re: PCB金镍层厚度测量位置哪个IPC有说明
From:	Judy Yang <[log in to unmask]>
Reply To:	Asia Committe Task Group Forum <[log in to unmask]>, Judy Yang <[log in to unmask]>
Date:	Thu, 18 Nov 2010 09:42:12 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

大家好,请问下,回流炉的油滴到PCA上,会影响焊接吗?需要怎么处理呢?

Thanks & Best Regards
Judy Yang/杨敏燕
Sr. Quality Engineer
Jabil Circuit (Wuxi) Co., LTD
LotJ9,J10 Export Processing Zone, Wuxi,
Jiangsu Province, P.R.China (214028)
Tel: 0510-85206303


-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of David Bergman
Sent: Wednesday, November 17, 2010 11:56 PM
To: [log in to unmask]
Subject: Re: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明

Hi Borch,

I assume you are asking about ENIG.
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards recommends the use of XRF for this thickness measurement.  I did not find a specific recommendation as to the preferred measurement location on the ENIG coated surface.

Best regards,
Dave

David W. Bergman   大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
Skype: davidbergmanipc
www.ipc.org

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Borch Li
Sent: Tuesday, November 16, 2010 7:58 PM
To: Listserv TGAsia
Subject: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明

Hi All,
哪位兄弟知道PCB金镍层厚度测量位置哪个IPC有说明.谢谢

Best regards&Thanks!
Multek B5 PQE
Borch Li

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