请把我从这个群中删掉。谢谢！
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Harry Yonghu. Wang
Sent: Wednesday, July 09, 2014 10:31 AM
To: [log in to unmask]
Subject: Re: [TGAsia] FW: [TGAsia] 关于混合集成电路封装后水汽超标问题
在收件箱里建一个TGAsia文件夹，并设置规则来自TGAsia的邮件自动进入该文件夹，
以方便管理。
"Jack_jiang(b �玉�)" <[log in to unmask]>编写：
�把我���群中�掉. ��!
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Shirley He
Sent: Wednesday, July 09, 2014 10:05 AM
To: [log in to unmask]
Subject: Re: [TGAsia] 关于混合集成电路封装后水汽超标问题
请把我从这个群中删掉。谢谢！
Thanks & Best Regards!
Shirley He Meiai | QA Department
VENTURE
ShangHai GES Information Technology CO. Ltd (Member of Venture Group of
Companies) Co Registration No. 310115400065538 | 668 Li Shi Zhen Rd |
Shanghai Zhangjiang Hi-Tech Park | China | Ext: 8219 | Main +86 21
38984898 | Fax +86 21 50806968 | URL:
www.venture.com.sg<http://www.venture.com.sg/>
t Please consider the environment before printing this e-mail
"Wang, Jianhua" <[log in to unmask]> Sent by: TGAsia <[log in to unmask]>
2014-07-09 09:54
Please respond to
"Wang, Jianhua" <[log in to unmask]>
To
<[log in to unmask]>
cc
Subject
Re: [TGAsia] 关于混合集成电路封装后水汽超标问题
请不要把删除地址的邮件发给所有人。
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Johnny Man
Sent: 2014年7月9日 9:52
To: [log in to unmask]
Subject: Re: [TGAsia] 关于混合集成电路封装后水汽超标问题
请删除我的邮件地址([log in to unmask]<mailto:[log in to unmask]>). 谢!
From: TGAsia [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of
[log in to unmask]<mailto:[log in to unmask]>
Sent: Wednesday, July 09, 2014 9:47 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TGAsia] 关于混合集成电路封装后水汽超标问题
我的建议是：
1. 待扑胶（灌封）产品扑胶之前必须作预热处理，例如在120°高温下至少烘烤
1~2小时，然后冷却至60°左右立刻开始扑胶处理
2. 严格按照胶料的烘干工艺进行烘烤固化；
3. 选择吸水率较低的胶料作为最佳扑胶材料。
上述建议供你参考！谢谢！
____________________
Thanks and best regards,
Harry Liu
Teka Interconnection Systems
Tel: 86-755-27099753 Fax:27099652
Cell: 18923801962 Skype:harrylau2008
E-mail:[log in to unmask]<mailto:[log in to unmask]>
Website: http://www.tekais.com<http://www.tekais.com/>
http://www.tekais.com/animation.htm
From: xjq <[log in to unmask]<mailto:[log in to unmask]>>
To: <[log in to unmask]<mailto:[log in to unmask]>>
Date: 07/09/2014 12:30 AM
Subject: [TGAsia] 关于混合集成电路封装后水汽超标问题
Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]>>
________________________________
各位同行:
有个问题咨询一下，我这边在开发混合集成电路，H级厚膜电源产品，之前产品
没问题，最近在封后进行水汽含量测试时，超过了5000ppm，内部磁罐用的胶不少。
查了氮气浓度、手套箱露点、技术状态等，都没有发现问题，后来延长了封前
烘烤时间（30小时），效果也不理想，想问问还可能有什么原因？如何解决？
[log in to unmask]<mailto:[log in to unmask]>
--
发自 Android 网易邮箱
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