能不能说具体点，或者有没有谁能提供这样的软件应用服务的！ 

-----Original Message-----
From: shi hongbin [mailto:[log in to unmask]] 
Sent: 2010年11月11日 15:19
To: Asia Committe Task Group Forum; Wei Wen
Subject: Re: [TGAsia] Thermal analysis

ansys就可以

在 2010年11月11日 下午4:17，Wei Wen <[log in to unmask]> 写道：
> 我们没有专业的热分析工程师，不知道有没有ＰＣＢ布局工程师有这方面的经验的，通常是用什么样的软件可以来做模拟？谢谢！
> ________________________________
> From: SUN Zhaopu [mailto:[log in to unmask]]
> Sent: 2010年11月11日 15:12
> To: Asia Committe Task Group Forum; Wei Wen
> Subject: RE: [TGAsia] Thermal analysis
>
> 你们有热分析的工程师吗？做好请专业工程师来做。
> ________________________________
> From: TGAsia [mailto:[log in to unmask]] On Behalf Of Wei Wen
> Sent: 2010年11月11日 14:56
> To: [log in to unmask]
> Subject: [TGAsia] Thermal analysis
>
> 大家好，
>
> 向各位请教一个问题，因为有一个元件的特殊封装（QFP mix
> QFN）水洗工艺过程中很难洗干净QFN下散热Pad的Flux残留。我们的提议是更改PCB设计，改动单个大的散热焊盘为多个小焊盘并从PCB反面
> 增加非电镀通孔以便水洗时溶液容易通过，因为散热焊盘面积的缩小会导致散热效率不同，我们需要提供给客户一份散热分析报告以证明这样更改的可行性，不
> 知如何来做这个散热分析？
>
> 目前不能改成免洗工艺原因是测试点的Flux残留会影响到测试的可靠性。
>
> WenWei
> Flextroncis Suzhou
>
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--
Best Regareds!
SHI Hongbin (史 洪賓)

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