谢谢,我说的是整板电金板.有客户居然发现SMT焊接不良后,通过测试孔环位置的金厚(金厚正好比客户要求高一点点),把问题推给PCB金厚过厚引起焊接不良.

Best regards&Thanks!
BU-PLG(QA): Borch Li
李保春
Tel:25234/695362

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of David Bergman
Sent: 2010年11月17日 23:56
To: [log in to unmask]
Subject: Re: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明

Hi Borch,

I assume you are asking about ENIG.
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards recommends the use of XRF for this thickness measurement.  I did not find a specific recommendation as to the preferred measurement location on the ENIG coated surface.

Best regards,
Dave

David W. Bergman   大山人
Vice President, International Relations
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2840 tel
+1 847-615-5640 fax
+1 847-867-1388 mobile
[log in to unmask]
Skype: davidbergmanipc
www.ipc.org

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Borch Li
Sent: Tuesday, November 16, 2010 7:58 PM
To: Listserv TGAsia
Subject: [TGAsia] PCB金镍层厚度测量位置哪个IPC有说明

Hi All,
哪位兄弟知道PCB金镍层厚度测量位置哪个IPC有说明.谢谢

Best regards&Thanks!
Multek B5 PQE
Borch Li

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