TGASIA Archives

May 2013

TGAsia@IPC.ORG

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Thu, 9 May 2013 13:18:19 +0800
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Look like PCB issue

What's soldering process application for this project? Used wave soldering / robot soldering or reflow (PIH)...

What's the parameter settings?

Rgds 

Jake

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jeff Chen
Sent: 2013Äê5ÔÂ9ÈÕ 12:20
To: [log in to unmask]
Subject: [TGAsia] Soldering bubble problem root


Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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