以下校审仅供参考：







 



Conductor Base Spacing               导线基本间距          60.0252

The spacing between conductors at the plane of the surface of a base material. (See also "Design Spacing of Conductors.") (See Figure C-8.)

基材表面平面处导线之间的间距。（参见“导线的设计间距。”）（见图C-8。）

▲导线底部间距---基材表面平面上的导线间的距离。





Component Mounting Site          元件安装位置                    70.1632

A location on a Packaging and Interconnecting structure (P&I) that consists of a land pattern and conductor fan-out to additional lands for testing or vias that are associated with the mounting of a single component.

在封装和互连结构（P&I）上的特定区域，由连接盘图形和与到达用于测试或导通孔的其它连接盘的导线输出组成，与单个元件的安装有关。



▲     在封装和互连结构（P&I）上的特定位置，包括连接盘图形及通向附加连接盘的导线输出端，这些附加连接盘用于与安装单个元件有关的测试或导通孔。





Connector Housing                       连接器外壳                 37.0271

A plastic shell that holds electrical contacts in a specific field pattern that may also have polarization/keying bosses or slots.

将电接触件以特定形状固定的塑料外壳，也可能会有定位/锁紧凸出键或槽。



▲将电接触件按特定电路图形固定的塑料外壳，该特定电路图形也可以有定位/键控突起或槽。



 



Contact Spring                                接触弹簧                    37.0282

The spring member of a socket-type contact that forces the engaging pin-type contact into a position of positive intimate contact.

插座型接触件的弹簧部分，它迫使插针型接触件插至可靠紧密接触的位置。

▲接触簧片---插孔接触件的弹性件，该弹性件对插入可靠紧密接触位置的插针接触件施加力。



















Drill Bit                                              钻头                              51.1702

A rod with spiral flutes (grooves) and an obtuse angled point with sharpened cutting edges used to make holes by rotary action.

一种带有螺旋凹槽的杆，头部为带有刃口的钝角尖，通过旋转运动制作孔。

▲一种带有螺旋凹槽的杆（棒），顶端为带有锋利切削刃口的钝角头，通过旋转运动制作孔。





Dry Glass (Clad Laminate)           干玻（覆箔层压板）       41.1706

A general reference to the appearance of a laminate where the reinforcement is highly visible, due to low/lost resin content or poor wetting/encapsulation of the resin to the reinforcement, although the resin coverage is acceptable.

一种层压板外观的常规参照，其中，由于树脂含量低/损失或树脂对增强材料的润湿/密封不良，使得增强材料非常明显，尽管树脂覆盖率是可接受的。



▲干玻纤---一般涉及到层压板的外观。由于树脂含量低/损失或树脂对增强材料的润湿性/包裹性差，使得增强材料非常明显，尽管树脂覆盖率可接受。



Embedded Fiber (Base Materials)      埋纤（基材）          44.1825

An inclusion which has an insignificant width or diameter but has significant length, usually but not always in a curly or twisted configuration, generally from organic sources such as clothing or packaging materials.

一种宽度或直径可忽略、但长度较明显的夹杂物，通常为但不总是弯曲或扭曲外形，一般源于有机物，如布料或包装材料。



▲一种宽度或直径可忽略、但长度较明显的夹杂物，其外形通常是卷曲或扭曲的，一般来自有机物，如布料或包装材料。



Eutectic Die Attach                        共晶芯片贴装             74.0454

The mounting of a semiconductor die to a base material with a preform of a eutectic metal alloy that is brought to its eutectic melting temperature.

采用达到共晶熔融融温度的共晶金属合金预成型焊料，将半导体芯片安装到基材上的过程。



▲ 通过将达到共晶熔融温度的共晶金属合金（焊料）预成型，将半导体芯片安装到基材上。



Embedded Copper (Base Materials) 埋铜（基材）          45.1718

An inclusion which is composed of copper and sourced from the cladding, and may be particles from treatment transfer, broken away copper tooth, or spurious copper.

源于覆层的由铜组成的夹杂物，可能是处理转移的铜颗粒、断裂的铜刺，也可能是假铜。

▲由铜组成的夹杂物。这些夹杂物来自覆铜箔，可以是来自处理转移的铜箔微粒、断裂的铜屑，也可能不是铜。



 



Entry/Backup Material                  引入/支持材料                   51.1720

A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.

在钻孔或布板时，放于一叠印制板的顶部（引入）和/或底部（支持）用来制成钻孔，支撑钻孔边缘或切板侧面，以便将毛刺减少到最低的材料。



▲放置于一叠印制板顶部（进刀板）和/或底部（垫板）的材料，用来支撑钻孔或铣外形的刀刃，以使留存的刀屑减到最少。



Exposure Time (Component)    曝露时间（元器件）       30.1914

The compensation factor which accounts for the time after bake that the component manufacturer requires to process the components prior to bag seal.

烘烤后用于时间考量的补偿因素，元器件制造商要求在装入密封袋前处理元器件。



▲是元器件制造商需要在烘焙后至装袋密封前对元器件进行处理所用时间的补偿因素。



 



 



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