You can refer IPC-A-610D, chapter 8.2.12





Best Regards,



James Liu 刘春光

Director, Industry Programs 工业项目总监

IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel:   +86 21 5497 3435

Fax:  +86 21 5497 3437

MP:   +86 136 0133 3491

[log in to unmask]

www.ipc.org.cn



-----邮件原件-----

发件人: TGAsia [mailto:[log in to unmask]] 代表 Nancy Deng

发送时间: 2010年5月24日 8:53

收件人: Listserv TGAsia

主题: [TGAsia] accpetable criteria for solder joint under X-Ray



Hello, all:



Now X-Ray is used to check the solder joint for BGA, PQFN, D-PAK and so on. But we aren't very clear acceptable criteria for solder joint under X-Ray. We are using 2D X-Ray.

Would you please share your experience or your detail criteria with me?



I would much appreciate your quick response.



Best regards and thanks

Nancy Deng





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