TGASIA Archives

July 2011

TGAsia@IPC.ORG

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Subject:
From:
Richie Wang <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Richie Wang <[log in to unmask]>
Date:
Tue, 19 Jul 2011 08:58:13 +0800
Content-Type:
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各位大虾:
请教一个问题,SMD料在机器打件过程中粘料是什么原因引起,如何避免。制程中如何
杜绝此问题?谢谢!

Richie Wang

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