Dears,

Bonding，我觉得翻译为“键接”比较好，或者直接叫做“邦定”。

参考如下：
同样后缀的soldering，国内同行一般叫做“焊接”，所以类似的bonding叫做“键接”比较恰当，因为soldering、bonding都是电子装配互联的主要工艺，都是一种连接工艺。

直译为“邦定”，在南方沿海比较通俗易懂，基本是半官方的叫法了，但可能部分北方地区的同行和高校的老师，还是比较熟悉“键接”。

贾工的“引线键合”，英文对应还是wire bonding，单独的bonding这个词，个人觉得键接好。

抛砖！

Kind Regards,
 
Peter Deng(邓增文)
SGS Shenzhen E&E 
Soldering & Reliability & Failure Analysis
 
office: 0755-2671 0624
mobile: 138 2876 8267
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jia Bianfen
Sent: Wednesday, November 01, 2006 11:04 AM
To: [log in to unmask]
Subject: [TGA] 答复: [TGA] Re: (瑞星提示-此邮件可能是垃圾邮件)[TGA] Today's terms

bonding是否也称“引线键合”

如有任何意见和建议，请和我联系！

谢谢！

贾变芬
电话：内线 1603 外线 26771603
传真：26771091



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|         |           请答复 给 Asia   |
|         |           Committe Task    |
|         |           Group Forum; 请答|
|         |           复 给 zgfeng     |
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  |       收件人：  [log in to unmask]                                                                               |
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Metallized Land Areas                     金属化焊盘区域     22.1756

A pattern of conductive material used on a substrate to interconnect
electronic components. Widened conductor areas used as attachment point for
wire bonding or other devices.

基板上用以实现电子元件互连的导电材料图形。加宽的导体区域用作导线邦定或其他
器件的连接点。


----- Original Message -----
From: "Charlotte Hao" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 31, 2006 11:19 AM
Subject: (瑞星提示-此邮件可能是垃圾邮件)[TGA] Today's terms


Dear All,

Today there are two terms which are uncertain, would you like to help us?
Thanks and regards

Charlotte

Metal Migration                                 金属迁移
96.1445

The electrolytic transfer of metal ions along an electrically conductive
path from one metal surface to another when an electrical potential is
applied to the two metal surfaces.

当电压作用于两个金属表面时，金属离子在电解作用下通过电气导电通路从一金属表
面迁移到另一金属表面。



Metallized Land Areas                     金属化焊盘区域     22.1756

A pattern of conductive material used on a substrate to interconnect
electronic components. Widened conductor areas used as attachment point for
wire bonding or other devices.

基板上用以实现电子元件互连的导电材料图形。加宽的导体区域用作导线绑定或其他
器件的连接点。



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