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June 2010

TGAsia@IPC.ORG
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Subject:
Re: Solder mask which is suitable for molding
From:
Matthew Tsui <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Matthew Tsui <[log in to unmask]>
Date:
Thu, 3 Jun 2010 17:22:15 +0800
Content-Type:
text/plain
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text/plain (45 lines) 
Hi William,

Do you mean the Epoxy Molding Compound?

Regards,
Matthew Tsui
Senior Engineer
Tel : 2788 9403
Fax : 2784 4953
EPA Centre
P1408, City University of Hong Kong,
83 Tat Chee Avenue, Kln Tong, HK


On 3/6/2010 16:35, William Yeoh wrote:
> Hi,
>
> Does anyone have experience about solder mask which is suitable for molding,
> IC molding?
>
> Thank you!
>
> Best Regards,
> William Yeoh
> Aeroteq Solutions Sdn. Bhd.
> mailto:[log in to unmask]
> Tel#6-04-640-3665
> Fax#6-04-640-3666
> Hp#6-012-477-0720
>
>
>
>
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