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August 2009

TGAsia@IPC.ORG
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Subject:
答复: Solder Balls
From:
James Liu <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, James Liu <[log in to unmask]>
Date:
Wed, 19 Aug 2009 10:33:37 -0500
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text/plain
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text/plain (1 lines) 
Hi Charles,

Please note the amount of flux on your boards and the temperature of preheating. Boards should be dry before contacting solder.





Best Regards,



James Liu 刘春光

Director, Technology & Standardization 技术与标准总监

IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel:   +86 21 5497 3435

Fax:  +86 21 5497 3437

MP:   +86 136 0133 3491

[log in to unmask]<mailto:[log in to unmask]>

www.ipc.org.cn<http://www.ipc.org.cn>

________________________________

发件人: TGAsia [[log in to unmask]] 代表 Charles Lee(SVA) [[log in to unmask]]

发送时间: 2009年8月19日 11:03

收件人: Listserv TGAsia

主题: [TGAsia] Solder Balls



Dear All,



There are a great deal of tiny solder balls appeared in around PTH connector pins after wave soldering (PB Process) , please see the attached pictures.



Here we would like to seek your helps and suggestions on how to solve the solder ball issues, thanks!



Best regards

Charles Lee

[cid:[log in to unmask]][cid:[log in to unmask]]

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