Hi Shirley,
请参考IPC-2222
Table 9-3 镀覆孔径与引线直径的关系
引线直径
Level A
Level B
Level C
最大孔对最小引线直径
大于最小引线直径的量不超过 0.7 mm
大于最小引线直径的量不超过 0.7 mm
大于最小引线直径的量不超过 0.6 mm
最小孔对最大引线直径
大于最大引线直径的量不低于 0.25 mm
大于最大引线直径的量不低于 0.20 mm
大于最大引线直径的量不低于 0.15 mm
Thanks and Best Regards
Leesha PENG 彭丽霞
GM IPC China
IPC中国总经理
18616593891
-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 LiHong MENG
发送时间: 2012年6月12日 11:40
收件人: TGAsia
主题: [TGAsia] 答复: [TGAsia] 答复: [TGAsia] 答复: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
目前IPC已起草：IPC-7251<http://www.ipc.org/committeedetail.aspx?Committee=1-13> Generic Requirements for Through-Hole Design and Land Pattern Standard
另外，AJ-820A中有部分描述：
[cid:[log in to unmask]]<mailto:[cid:[log in to unmask]]>
Best regards
IPC中文培训官网：http://www.ipc.org.cn/Training-Certification/index.html
孟丽红
BDA Coordinator 业务拓展协调
IPC China
TEL：0755-86141218/19 分机：8012
[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]> 代表 Jian He 何健
发送时间: 2012年6月12日 11:12
收件人: TGAsia
主题: [TGAsia] 答复: [TGAsia] 答复: [TGAsia] 答复: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
一般要求是这样的：
手插DIP元件焊盘孔径：d（元件脚直径）+0.2mm
AI元件焊盘孔径：d+0.3或0.4mm，一般根据机台的精度来试验制定的
貌似IPC也有这方面的标准吧，之前听说过 IPC-7352，但是至今还没见过这个标准呢，可以去了解下
***************************************************************************
制造处(MFG)/工业工程部(IE) /何健
福建捷联电子有限公司/ Top Electronics（Fujian）Co.,Ltd
地址(Add)：中国.福建省福清市元洪路上郑
(Shangzheng Yuanhong Road.Fuqing City,Fujian Province,P.R.China )
邮编(Postcode)：350301
电话(Tel)：+86-0591-85285555-7084
传真(Fax)：+86-0591-85285447
手机（Mobile)：13506979622
电邮(E-mail)：[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
MSN：[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
网址：http://www.tpvaoc.com<http://www.tpvaoc.com/<http://www.tpvaoc.com%3chttp:/www.tpvaoc.com/>>
***************************************************************************
发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]><mailto:[mailto:[log in to unmask]]> 代表 Shirley He
发送时间: 2012年6月12日 9:58
收件人: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
主题: Re: [TGAsia] 答复: [TGAsia] 答复: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
各位高手，
请教一下，圆柱体的元器件和PCB PAD的设计有要求吗？如果有，应该参考那份标准？
还有，通孔元气件引脚的直径和PCB 通孔开口的比例应该怎样计算才能满足上锡要求，有没有标准可以参考？
谢谢了！
Shirley He
2012/06/12
Jessy Lai <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
2012-06-07 13:42
Please respond to
Jessy Lai <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
To
<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
cc
Subject
[TGAsia] 答复: [TGAsia] 答复: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
元件引脚直径与PCB焊盘孔径应遵循以下关系：
元件脚直径 PCB焊盘孔径
D<=等于1.0mm D+0.3/0.15mm
1.0mm < D <=等于1.0mm D+0.4/0.2mm
D>2.0 D+0.5/0.2mm
Thanks & Best Regards,
PE Jessy.Lai
**************************************
Telephone : +86-0769-87290991转8829
No.6 Lindong 3Road Lin Cun Industral Center TangXia Dongguan Guangdong,P.R.C Email : [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
Website : www.note.se<http://www.note.se<http://www.note.se%3chttp:/www.note.se>>
发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]><mailto:[mailto:[log in to unmask]]> 代表 Wen Zhong 钟文
发送时间: 2012年6月7日 12:58
收件人: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
主题: [TGAsia] 答复: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
Dear all：
我觉得有道理，我们公司现在的CEM-1 板材的孔洞也非常严重。孔与引脚直径的匹配我认为是一个非常重要的因子。
现在我们是0.4，但是有实验表明，0.3以下是比较优的匹配
BR
My office phone number have been changed to 7166.
***************************************************************************
制造处(MFG)/工业工程部(IE) /钟文（Kevin）
福建捷联电子有限公司/ Top Electronics（Fujian）Co.,Ltd
地址(Add)：中国.福建省福清市元洪路上郑
(Shangzheng Yuanhong Road.Fuqing City,Fujian Province,P.R.China )
邮编(Postcode)：350301
电话(Tel)：+86-0591-85285555-7166
传真(Fax)：+86-0591-85285447
手机（Mobile)：15980730668
电邮(E-mail):[log in to unmask]
MSN：[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
网址：http://www.tpvaoc.com<http://www.tpvaoc.com/<http://www.tpvaoc.com%3chttp:/www.tpvaoc.com/>>
***************************************************************************
发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]><mailto:[mailto:[log in to unmask]]> 代表 Tang Xianjun
发送时间: 2012年6月7日 10:59
收件人: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
主题: [TGAsia] 回覆: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
还有一个重要的因素，元件脚大小和孔径的匹配性。如果超过0.2mm，引起焊接锡洞的风险也大大升高。個人非常不贊同你的觀點，因為你的這個結論是錯誤的。
Best Regards
寄件者: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]><mailto:[mailto:[log in to unmask]]> 代理 维乐他爸
寄件日期: 2012年6月7日 10:23
收件者: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
主旨: [TGAsia] 回复：[TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
还有一个重要的因素，元件脚大小和孔径的匹配性。如果超过0.2mm，引起焊接锡洞的风险也大大升高。
------------------ 原始邮件 ------------------
发件人: "Bohao Zhou"<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>;
发送时间: 2012年6月7日(星期四) 上午9:48
收件人: "TGAsia"<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>;
主题: [TGAsia] 答复: Re: [TGAsia] 答复: [TGAs ia] 请教,焊锡引脚上有空洞的原因及判定基准
*****************************************************
太仓阿尔派电子有限公司
生产技术课：周博浩
地址：江苏太仓经济开发区广州西路1号
TEL：0512-53568111-6421
FAX：0512-53568112
E-Mail：[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
发件人: BOHAO ZHOU/AOTA/SPEED
收件人: <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
抄送: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
日期: 2012-06-07 09:44
主题: 答复: Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
关于这个问题我们做了很多实验,减少和增大松香的量,增加预热的时间,提高焊接温度
和时间,但是效果都不是很明显,
也尝试过基板预烘干(这个有点效果,但不能彻底解决问题),想请问一下基板预烘干的
温度和时间一般设定为多少度烘干多长时间呢?
基板断面分析\X-RAY 也作过,但是还是没有找到真正的原因.
想请问还可以从哪些方面分析找原因呢?
发件人: <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
收件人: <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
日期: 2012-06-07 09:05
主题: Re: [TGAsia] 答复: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
发件人： TGAsia <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
这种情况还有一种可能，波峰焊在焊接前需要喷涂flux，flux受热时会发生分解产生
气体，要是喷涂的量过大或是flux的活性过强，产生的气体来不及排除，就有可能在
焊点中产生针孔
Thanks and Best Regards
Sonic Lu 陆尚
宠辱不惊，闲看庭前花开花落
去留无意，漫随天外云卷云舒
Autoliv Electronics China (ACE) Co.,Ltd
Tel: +86-21-67109300-3162
"Yun, Xunisa (惲黎銀 IES)"
<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
Sent by: TGAsia <[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>> To
<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
cc
2012-06-06 20:07
Subject
[TGAsia] 答复: [TGAsia] 请
Please respond to 教,焊锡引脚上有空洞的原因及
"Yun, Xunisa (惲黎銀 IES)" 判定基准
<[log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>>
我们称之为吹孔，通常是由于PCB 孔壁镀铜异常造成基材膨胀产生的气体外泄所
致，以我们的经验责任判定都是属PCB供应商的，可追偿。
通常需要切片进一步分析才能得到真正原因。
Best Regards
Xunisa, Yun
EXT: 63184，MVPN：663184
MPT/IPT – Inventec Group
发件人: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]><mailto:[mailto:[log in to unmask]]> 代表 Bohao Zhou
发送时间: 2012年6月6日 10:10
收件人: [log in to unmask]<mailto:[log in to unmask]<mailto:[log in to unmask]:[log in to unmask]>>
主题: [TGAsia] 请教,焊锡引脚上有空洞的原因及判定基准
请教各位专家一个问题:
基板在过完波峰焊以后,焊锡引脚上会发生空洞.
附照片:
(Embedded image moved to file: pic17035.gif)
请问产生空洞的原因会有哪些呢?另外IPC中有没有关于这方面的判定基准呢?
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