NMP is used for decapsulation/delayering of certain EEE parts and it is
called out in standards related to suspect part inspection I have helped
develop.

On Thursday, December 5, 2019, Dennis Fritz <[log in to unmask]> wrote:

> TechNet friends -
>
> I am on a short assignment from IPC Government Relations to decide whether
> to respond to a US EPA Risk Evaluation on some twenty priority chemicals.
> My assignment is NMP and methylene chloride.  Kelly Scanlon of IPC has
> already spear-headed evaluations of TBBPA for laminate and for
> formaldehyde.
>
> Anyway, we know of NMP use in the multilayer desmear line as a swellant.
> We are quantifying the use of NMP to dissolve polyimide (and perhaps other
> resins) to be able to coat electronics substrates.
>
> What we don't know is whether NMP (CAS number 872-50-4) is used in other
> circuit board applications, or used in mixtures for stripping or cleaning
> electronics.   Can you help?
>
> Last, I remember huge amounts of methylene chloride (CAS number 75-09)
> being used in the old days of solvent photoresist, but those products are
> long gone.   Does your now company use methylene chloride, alone or in
> mixtures - again for stripping or cleaning electronics?
>
> If you wish to respond off-line, that is fine with me.
>
> Denny Fritz
> Consultant
>
>
> --
> Denny Fritz
> Consultant
> 812 584 2687
>


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Bhanu Sood
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