Not long ago, in Technet forum discussed running reflow/cure vs cure/reflow for SMT double side assemblies.  In my former life, I was happy running curing bottom side first and reflowing top side later. Then wave solder bottom side.  I encountered no fuss, but it is a little bit of dilemma for now.  Now, I am in the middle of discussing a continuous SMT line for top and bottom side assemblies.  A few of companies that I visited in my former life run "cure/reflow" process for continuous assembly lines, but one company I visited recently run " reflow/cure" process.

Questions I want to throw at technet forum are;

What are your preferences?
What percentage of companies reflow/cure or cure/reflow processes?
What are pro's and con's of using either process for continuous assemblies?

telling you my preference is "cure/reflow" for continuous SMT assemblies.  Main reasons for my choice are: "can be easily changed to reflow/reflow", and " can use a single cure profile" for many different products and a fast cool down before processing top side assembly.  One negative is positioning support pins properly for top side printing.





 

Matthew S. Park
Sr. Process Engineer
Phoenix International Corp.
701-277-6434
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