TECHNET Archives

February 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Furrow, Robert Gordon (Bob)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Feb 2001 09:14:01 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines)
Kevin,

This sounds to me like it might be what IBM called a "double reflow"
failure. Is the crack a clean fracture right at the pad intermetallic
surface? Does the part see additional thermal excursion either through wave
solder or maybe repair of nearby components. I would be interested in seeing
a picture. Send it to [log in to unmask]

Thanks,
Robert Furrow
New Product Engineering
Lucent Technologies
978-960-3224    [log in to unmask]

> -----Original Message-----
> From: Kevin Stokes [SMTP:[log in to unmask]]
> Sent: Friday, February 16, 2001 8:33 AM
> To:   [log in to unmask]
> Subject:      [TN] Wetting issues...
>
> Everyone,
>
> I'm having an interesting problem with fall out from production.  There is
> one leg on one component in one position (with others of the same
> component with no problem) that appears to have a wetting problem.
> However, the fillets are well formed (not beaded up).  There is a crack
> under the solder pad, though.  Also, the solder has a flaky appearance.
> If you are interested, I could send a picture of the joint directly to
> your email, let me know.  We've had about 10 failures in production with
> one field return already.
>
> Thanks,
>
> Kevin
>
> Kevin Stokes
> Reliability Manager
> Kimball Electronics Group
> [log in to unmask]
> (812) 634-4207
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2