Dear jk
I don't see exactly what is new. We have two automatic lines bonding Al
wire on 0.1 um Au over 5 um Ni. We have used this for about 10 years. In
fact, if one could keep the Ni clean and fresh, no Au was needed at all!
But, unfortunately, the Ni has to be protected the few days from board
plating to automatic bonding. We tried 0.05 um Au, but the finish got
too porous and unreliable. Thick Au over Ni for Al wire bonding is
forbidden here.
The article seems to point at Al wire bonding.
Inge

-----Ursprungligt meddelande-----
Från: Joyce Koo [mailto:[log in to unmask]] 
Skickat: den 18 oktober 2005 18:32
Till: TechNet E-Mail Forum; Ingemar Hernefjord
Ämne: wire bondable immersion gold

I got this one today.  Anybody has some experiences about it?

http://www10.edacafe.com/nbc/articles/view_article.php?section=ICNews&ar
ticl
eid=214840

It claim 0.1 micron wire bondable gold...
                                            jk

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