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November 1999

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Nov 1999 12:19:38 -0600
Content-Type:
text/plain
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Hi TechNet! Just to add a bit of wordsmithing to Brian's internet references.
The electronics community has created itself a technical "cultural" bias which
is going to take some time to undo. We have interchangeably used "no clean" to
describe both the material and process aspects of a product (e.g. flux). We
should be using the term "low residue" to describe the material characteristics
of a flux - how much flux residue is left on a printed assembly after soldering
processing. We should be using the term "no clean" to describe the process
characteristics of a flux - is it removable  or non-removeable after solder
processing. The use of the term "no clean" for both the material and process
aspects is very confusing to the folks on the factory floor because they can
unintentionally misinterpret the product labeling as permission to no longer
clean an assembly which may not be the case. I also know very few process
engineers who are keen on having someone unfamiliar with their soldering process
to suggest that a "no clean" flux is ok.  The description of "using a low
residue flux in a no clean process mode" leaves little room for
misinterpretation. Ok, enough soapboxing.

Dave Hillman
Rockwell Collins
[log in to unmask]





Brian Ellis <[log in to unmask]> on 11/27/99 02:21:23 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Brian Ellis <[log in to unmask]>

To:   [log in to unmask]
cc:

Subject:  Re: [TN] Wave Soldering



The United Nations Environment Programme Solvents Technical Options
Committee gives an excellent explanation, with the advantages and
disadvantages of each, in Chapter 2 of their 1998 Report to the Parties to
the Montreal Protocol. This 200 + page report can be downloaded (free) in
PDF format from the non-commercial committee site at
http://www.protonique.com/unepstoc
or you may purchase the printed document from
http://www.unep.org/ozone

Brian

Alberto Callo wrote:

> Hi,
>
> I wonder if anyone can explain the difference between NO CLEAN and Water
> Soluble wave solder methods.
>

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