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Date: | Wed, 29 Jan 2014 22:03:51 +0000 |
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It is available online.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Wednesday, January 29, 2014 3:36 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?
H Jack, Please refer to the book-- Wirebonding in Microelectronics- by George Harman
Thank-you
Mumtaz
858-795-0112
Peregrine Semiconductor
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 1:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?
newbie question:
Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for us...
thanks,
Jack
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