Issues
1. Reflow. The oven cooling zone will be challenged. Will need a cooling station at post reflow to let the boards cool down. You will probably need a soak to minimize the temperature gradient across the board prior to reflow. Check to see the paste manufacturer's guidelines. The mass of the board will probably be more significant that the mass of the SMD being soldered onto the board.
2. Touch-up. Will probably need to use oven to preheat the board and a hot plate to keep the board heated while doing touchup.
3. Inspection. Probably will not get nice shiny solder joints due to slow cooling rates. 

Tom

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Monday, July 23, 2012 7:42 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] 10 oz Cu PCB Assys

Hello Fellow TechNetters:

Can anyone share some information on processing SMD's on PCB's that have 10 oz. of Cu?

Difficulties in processing, lessons learned, etc.

Thank you all in advance,
Bill



 

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